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1、微纳系统及加工外文文献综述班级:机设七班姓名:李文浩学号:2012210511日期:2015/12/2ApplicationofmicronanoprocessingtechnologyinthelithographyprocessandthelatestprogressAbstract:inthispaper,bycomparingtheUVexposure,electronbeamlithography,ionbeamlithography,scanningprobeexposureprocessing,nano
2、imprintlithographyandotherprocesses,andcombiningwiththelatestresearchprogress,thereasonsforthelong-termUVexposuretechnologyhasbecomethemainstreamtechnology.Keywords:lithography;exposuretechnique;application;differencebetweenSIintroductionphotolithographyispreci
3、sion,smallandcomplexgraphicsprocessingtechnologyonthefilmsurfaceandmetal,useittomanufactureparts:dividingscale,micromotorrotor,printedcircuitboard,porousmetalscreenandcameratubescreengridnetworketc..Exposuretechnologyisoneofthemostimportantbasictechnologiesinth
4、eprocessoflithography.Thispapermainlythroughthemicronanoprocessingtechnologycommonlyusedintheexposureofthecomparativeanalysis,andcombinedwithitslatestresearchprogress,analysisofUVexposuretechnologyhasbecomethemainstreamtechnologyforalongtime.2UVexposuretechnolo
5、gy2.1UVexposuretechnologyintroductionUVexposuretechnologyisatraditionalopticalexposuretechnology,therearetwobasicways:Shadowexposure(printingshadow)andprojectionexposure(printingprojection).Intheshadowtypeexposuretechnique,themaskisdirectlyexposedtothewafer,whi
6、chiscalledthecontactexposure.Themaskandthewaferkeepagaptorealizetheexposure.Contactexposuretechnologyisrelativelysimple,canobtainhigherresolution(about1m),butthemaskbetweenthemembraneandthechipeasilyclipintothedustparticles,causedbymaskpermanentdamage,reducerat
7、eoffinishedproducts.Proximityexposuredoesnotcausedamagetothedustparticles,butthegapbetweenthemaskandthewafer(typically10〜50m)canleadtoopticaldiffractionerrorsandreduceresolution.Projectionexposureistheuseofopticalprojectionimagingprinciple,throughtheprojectionl
8、enswillmaskversionoftheimageoflarge-scaleintegratedcircuits,suchasgraphics(1:1imageorreducedimage),projectionontothecoatedwithphotosensitiveglueonthewafer,completegraphicstr