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1、Ultra-thinChipTechnologyandApplicationsJoachimN.BurghartzEditorUltra-thinChipTechnologyandApplicationsEditorJoachimN.BurghartzInstitutfu¨rMikroelektronikStuttgart(IMSCHIPS)Allmandring30a70569StuttgartGermanyburghartz@ims-chips.deISBN978-1-4419-7275-0e-ISBN978-1-4419-7276-7DOI10.1007/978-1-4
2、419-7276-7SpringerNewYorkDordrechtHeidelbergLondon#SpringerScience+BusinessMedia,LLC2011Allrightsreserved.Thisworkmaynotbetranslatedorcopiedinwholeorinpartwithoutthewrittenpermissionofthepublisher(SpringerScience+BusinessMedia,LLC,233SpringStreet,NewYork,NY10013,USA),exceptforbriefexcerptsi
3、nconnectionwithreviewsorscholarlyanalysis.Useinconnectionwithanyformofinformationstorageandretrieval,electronicadaptation,computersoftware,orbysimilarordissimilarmethodologynowknownorhereafterdevelopedisforbidden.Theuseinthispublicationoftradenames,trademarks,servicemarks,andsimilarterms,ev
4、eniftheyarenotidentifiedassuch,isnottobetakenasanexpressionofopinionastowhetherornottheyaresubjecttoproprietaryrights.Printedonacid-freepaperSpringerispartofSpringerScience+BusinessMedia(www.springer.com)ToUlrichGo¨sele25.1.1949–8.11.2009PrefaceAftermorethan40yearsofsemiconductortechnologyad
5、vancementwehaveacceptedthetechnicalframeworkthathasenabledustobringtheminimumfeaturesizedownto45nm,anincredible1,000-foldreductionfromtheintegratedcircuitsoftheearly1970s.Goingfurther,wemayfacelimitsindevicedownscalingduetothephysicalsiliconcrystallinestructure.Therefore,besidesthecoordinat
6、edminia-turization(MoreMoore),accordingtoGordonMoorespredictionfrom1965,theInternationalSemiconductorRoadmapforSemiconductors(ITRS)nowalsocon-sidersapplicationsofsilicontechnologythatdependlessonpushingdowntheminimumfeaturesize(MorethanMoore).However,thebasicconceptofsiliconwafermanufacturi
7、ngappliestobothMoreMooreandMorethanMooreapplicationsandessentiallyisnotputintoquestion.But,toanovicetosilicontechnology,severalquestionsmaycomeupthatwouldnotlikelyberaisedbytheexpert:Whydoweacceptconsiderablemateriallossbycuttingrectangularchipsfromacirc