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ID:34028219
大小:19.41 MB
页数:511页
时间:2019-03-03
《075. Wafer Bonding - Applications and Technology (2004)》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
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6、estructiveApplicationsandTechnologyMaterialsCharacterizationEditors:M.AlexeandU.GiiseleWithApplicationstoAerospaceMaterialsEditors:N.G.H.Meyendorf,P.B.Nagy,76SpirallyAnisotropicCompositesByG.E.Freger,V.N.Kestelman,andS.1.RokhlinandD.G.Freger68DiffractionAnalysisoftheMicrostructureofM
7、aterialsEditors:E.J.MittemeijerandP.ScardiVolumes10-60arelistedattheendofthebook.M.AlexeU.Gosele(Eds.)WaferBondingApplicationsandTechnologyWith372Figuresand25TablesiSpringerDr.M.AlexeProf.Dr.U.GoseleMaxPlanckInstituteofMicrostructurePhysicsWeinberg2,06120Halle(Saale),GermanyE-mail:ma
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