075. Wafer Bonding - Applications and Technology (2004)

075. Wafer Bonding - Applications and Technology (2004)

ID:34028219

大小:19.41 MB

页数:511页

时间:2019-03-03

075. Wafer Bonding - Applications and Technology (2004)_第1页
075. Wafer Bonding - Applications and Technology (2004)_第2页
075. Wafer Bonding - Applications and Technology (2004)_第3页
075. Wafer Bonding - Applications and Technology (2004)_第4页
075. Wafer Bonding - Applications and Technology (2004)_第5页
资源描述:

《075. Wafer Bonding - Applications and Technology (2004)》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库

1、SpringerSeriesinMATERIALSSCIENCE75Springer-VerlagBerlinHeidelbergGmbHSpringerSeriesinMATERIALSSCIENCEEditors:R.HullR.M.Osgood,Jr.J.ParisiH.WarlimontTheSpringerSeriesinMaterialsSciencecoversthecompletespectrumofmaterialsphysics,includingfundamentalprinciples,physicalproperties,materia

2、lstheoryanddesign.Recognizingtheincreasingimportanceofmaterialsscienceinfuturedevicetechnologies,thebooktitlesinthisseriesreflectthestate-of-the-artinunderstandingandcontrollingthestructureandpropertiesofallimportantclassesofmaterials.61FatigueinFerroelectricCeramics69Chemical-Mechan

3、icalPlanarizationandRelatedIssuesofSemiconductorMaterialsByD.C.LupascuEditor:M.R.Oliver62Epitaxy70ApplicationsoftheIsotopicEffectPhysicalPrinciplesinSolidsandTechnicalImplementationByG.V.PlekhanovByM.A.Herman,W.Richter,andH.Sitter71DissipativePhenomena63FundamentalsinCondensedMattero

4、fIon-IrradiatedPolymersSomeApplicationsByD.FinkByS.DattaguptaandS.Puri64MorphologyControlofMaterials72PredictiveSimulationandNanoparticlesofSemiconductorProcessingAdvancedMaterialsProcessingStatusandChallengesandCharacterizationEditors:J.DabrowskiandE.R.WeberEditors:Y.WasedaandA.Mura

5、matsu73SiCPowerMaterials65TransportProcessesDevicesandApplicationsinIon-IrradiatedPolymersEditor:Z.C.FengByD.Fink74PlasticDeformation66MultiphasedCeramicMaterialsinNanocrystallineMaterialsProcessingandPotentialByM.Yu.GutkinandLA.Ovid'koEditors:W.-H.TuanandJ.-K.Guo75WaferBonding67Nond

6、estructiveApplicationsandTechnologyMaterialsCharacterizationEditors:M.AlexeandU.GiiseleWithApplicationstoAerospaceMaterialsEditors:N.G.H.Meyendorf,P.B.Nagy,76SpirallyAnisotropicCompositesByG.E.Freger,V.N.Kestelman,andS.1.RokhlinandD.G.Freger68DiffractionAnalysisoftheMicrostructureofM

7、aterialsEditors:E.J.MittemeijerandP.ScardiVolumes10-60arelistedattheendofthebook.M.AlexeU.Gosele(Eds.)WaferBondingApplicationsandTechnologyWith372Figuresand25TablesiSpringerDr.M.AlexeProf.Dr.U.GoseleMaxPlanckInstituteofMicrostructurePhysicsWeinberg2,06120Halle(Saale),GermanyE-mail:ma

8、lexe@mpi-hal

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。