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1、Chapter18ElectromagneticShieldingofTransceiverPackagingUsingMultiwallCarbonNanotubesWood-HiCheng(*ü),Chia-MingChang,andJin-ChenChiu18.1IntroductionThewidespreaddeploymentoflow-costopticalaccessnetworksforfiber-to-the-home(FTTH)applicationswillnecessitateaconsiderab
2、lereductioninthecostofkeycomponentssuchasopticaltransceivermodules.Opticaltransceivermodulecostsareprimarilydependentontheirpackaging.Owingtoitslow-costnatureandeaseofmanufacture,plasticpackagingtechnologyhasbeenconsideredasoneofthemajorchoicesforreducingthecostsof
3、fabricatingopticaltransceivermodulesforuseinFTTHapplications[15].However,plasticsaloneareinherentlytrans-parenttoelectromagnetic(EM)radiation,andhenceprovidenoshieldingagainstradiationemissions.ToimproveEMshieldingforplasticpackaging,electronicconductivepropertiesh
4、avetobeaddedintotheplastichosts.Currentlyavailabletechniquesforelectromagneticinterference(EMI)shieldingincludeconductivesprays,conductivefillers,zinc-arcspraying,electroplatingorelectrolysisplatingonhousingsurfaces,modificationsofelectricalpropertiesduringthemoldi
5、ngstage,andothermetallizationprocesses.Amongthesemethods,themostpopularoneforEMshieldingistocompoundplasticswithdiscontinuouselectronicconduc-tivefillers,suchasmetalparticles,metalflakes,stainlessfiber,graphitizedcarbonparticles,graphitizedcarbonfibers,metal-coated
6、glass,andcarbonfibers[6,7].Experimentalevidencehasshownthatcarbonfiberswithaspectratiosof1,000aregoodconductivefillersforprovidinghighEMshielding[8,9].Opticaltrans-ceivermodulesemployingnylonandliquidcrystalpolymer(LCP)reinforcedwithcarbonfibershowedthatthemeasured
7、shieldingeffectiveness(SE)wasover20dBwith25%ofweightpercentageofthecarbonfibermixedinthenylonandLCPcomposites[3,4].Inaddition,theSEperformancewillbehigherforhigherweightpercentagesofthecarbonfiberandthickermaterialofthecarbonfibermixture.However,withsuchplasticcomp
8、osites,thedominantcostofthepackageistheW.-H.ChengInstituteofElectro-OpticalEngineering,NationalSunYat-senUniversity,Kaohsiung,80424,Taiwan,ROCJ.E
