micro-usb电连接器无铅焊点热疲劳寿命分析

micro-usb电连接器无铅焊点热疲劳寿命分析

ID:33788448

大小:2.62 MB

页数:64页

时间:2019-03-01

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1、ABSTRACTABSTRACTWiththerapiddevelopmentofmodernindustry,Micro-USBconnectorshavebeenanintegralpartofpeople'slives,sotheMicro-USBconnector’slifetimehasbeenhighlyputontheagenda.Becausethesolderjointisthebridgesoftheelectricalandmechanicalcharacteristics,oncethesolderjointfailu

2、rewilldirectlycauseMicro-USBconnector’sfailure.Sothepredictionofsolderjoint’slifeisofgreatsignificance.Underthecyclicaltemperature(-55℃to+125℃),thejointssolder’slifehasbeendescribedinthisthesis.Thesolderjoint’smaterialsisSn3.5Ag0.75Cuwhosemeltingtemperatureisabout217℃.Whent

3、hetemperaturereachesthemeltingpointof0.5,thesolderwillcreepandstressrelaxation,whichcaneffectivelypredicttheservicelifeofthesolderjointsunderextremeoperatingconditions.Underthecyclicaltemperature,thelifepredictionoftheMicro-USBconnectormainlytasksare:usingthe3Dmodelingsoftw

4、arePro/EestablishestheentitymodelMicro-USBconnectorwhichincludestheMicro-USBwholeconnectorbody,metalPin,wiresandSnAgCulead-freesolder,andremovingthesharppartiallywhichdonotimpacttheanalysis,thenimportingitintothefiniteelementanalysissoftwareANSYSforanalysis.Themechanicalbeh

5、aviorofthesolderjointsaredescribedbytheANANDunityconstitutiveequationmodelundercyclictemperatureloads.UsingcommandsofparametricdesignlanguageAPDLwritesthecyclictemperatureloadsandsimulatingthestressandstraindistributionsofsolderjointsbytheoreticalanalysis.Asthecoefficientof

6、thermalexpansionmismatchesamongallofthematerials,themaximumstress-strainhasbeenfoundatthelowtemperature.Andatthehightemperature,thethermalstress-strainisdecreased.Duringtheheatingorcoolingtemperature,thestress-strainofsolderjointschangesgreatest,whichresultsinthefinalsolder

7、crackinitiationatthisperiodthenfailure.UsingCoffin-Mansonempiricalformulabasedonplasticstraincalculatesthethermalfatiguelifeofsolderjointsunderthermalcyclingtemperatureeffects.Finalresultsshowedthatunderthecyclingtemperature,thesolderjointstheMicro-USBconnector’maximumstres

8、s-strainisfoundatthebottomofthesolderjointswheretouchonthemetalPin,whilethemiddles

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