湿热载荷下无铅焊点电阻应变分析

湿热载荷下无铅焊点电阻应变分析

ID:33738396

大小:3.23 MB

页数:68页

时间:2019-02-28

湿热载荷下无铅焊点电阻应变分析_第1页
湿热载荷下无铅焊点电阻应变分析_第2页
湿热载荷下无铅焊点电阻应变分析_第3页
湿热载荷下无铅焊点电阻应变分析_第4页
湿热载荷下无铅焊点电阻应变分析_第5页
资源描述:

《湿热载荷下无铅焊点电阻应变分析》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库

1、中南大学硕士论文ABSTRACTThereliabilityoflcad.freesolderiointscontinuestoremainamajorconcernasthepopularityoflead—freesolder.So,allkindsofreliabilityexperimentsoflead.freesolderjointsareraisedaccordingly.Electroniccomponentsareinfluencedbytemperatureandhumidityatthesametimeintheactu

2、alenvironment.Temperatureandhumidityconstituteahighproportioninthefailurecauseofsolderioints,SOreliabilityaboutsolderjointsconsiderationwhichisintheenvironmentoftemperatureandhumidityisnecessary.Firstly,thispapersummarizessituationoflead—freesolderjointsreliabilitystudy,ana

3、lyzestheimportanceoflead—freesolderjointsreliabilitystudy,overviewsmeaningsandsituationofstudyaboutlead.freesolderiointsreliabilityunder也eloadoftemperatureandhumidity,analyzesfeasibilityofaelectricalmeasurementmethodaboutlead.freeiointsreliabilityandsituationofstudyonelectr

4、icalmeasurement.Failuremechanismoflead.freesolderioints(SnAgCu)hasbeenresearchedinthecircumstanceoftemperatureandhumidityloadalone,andcombinedaction.Accordingtofailuremechanismoftheexposedlcad.freesolderiointsunderthecombinedactionoftemperatureandhumidity,simplemodelofinval

5、idationsolderjointswasbuiltandrelationexpressionbetweendamageofsolderjointsandresistancestrainwasdeduced.ItprovidesfundamentalbasisforcharacteristicresearchofSnAgCusolderjointsresistancestrainundertheloadoftemperatureandhumidity.Onthefoundationofformertestsystemofmicro.resi

6、stance,testsystemofsolderjointswasdesignedtomeasureresistanceintheenvironmentoftemperatureandhumidity.Four-probemethodinmicro.resistancemeasurementhasbeenreplacedbyfive—probedifferencemethodwhichisprecisethroughexperimentalproofinthepaper.Inthisarticle,withSnAgCusolderjoint

7、sspecimens(thewidthandlengthislmm,differentthickness),fivekindsofexperimentshavebeenperformedbyfive—probedifferencemethod,includinghigh—lowthermalshockcycletestwithlowhumidity,hightemperaturecyclewithlowhumidity,hightemperatureconstant,humiditycycleunderlowtemperatureandhum

8、iditycycleundermediumtemperatureconstant.Alotofsolderspecimens’testingresultshaveb

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。