Investigations on Microstructure and Mechanical Properties of the Cu_Pb-free Solder Joint Interfaces (2016)

Investigations on Microstructure and Mechanical Properties of the Cu_Pb-free Solder Joint Interfaces (2016)

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大小:7.31 MB

页数:153页

时间:2019-02-25

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1、SpringerThesesRecognizingOutstandingPh.D.ResearchQingkeZhangInvestigationsonMicrostructureandMechanicalPropertiesoftheCu/Pb-freeSolderJointInterfacesSpringerThesesRecognizingOutstandingPh.D.ResearchAimsandScopeTheseries“SpringerTheses”bringstogetheraselectionoftheveryb

2、estPh.D.thesesfromaroundtheworldandacrossthephysicalsciences.Nominatedandendorsedbytworecognizedspecialists,eachpublishedvolumehasbeenselectedforitsscientificexcellenceandthehighimpactofitscontentsforthepertinentfieldofresearch.Forgreateraccessibilitytonon-specialists,th

3、epublishedversionsincludeanextendedintroduction,aswellasaforewordbythestudent’ssupervisorexplainingthespecialrelevanceoftheworkforthefield.Asawhole,theserieswillprovideavaluableresourcebothfornewcomerstotheresearchfieldsdescribed,andforotherscientistsseekingdetailedbackg

4、roundinformationonspecialquestions.Finally,itprovidesanaccrediteddocumentationofthevaluablecontributionsmadebytoday’syoungergenerationofscientists.Thesesareacceptedintotheseriesbyinvitednominationonlyandmustfulfillallofthefollowingcriteria•TheymustbewritteningoodEnglish

5、.•ThetopicshouldfallwithintheconfinesofChemistry,Physics,EarthSciences,EngineeringandrelatedinterdisciplinaryfieldssuchasMaterials,Nanoscience,ChemicalEngineering,ComplexSystemsandBiophysics.•Theworkreportedinthethesismustrepresentasignificantscientificadvance.•Ifthethesis

6、includespreviouslypublishedmaterial,permissiontoreproducethismustbegainedfromtherespectivecopyrightholder.•Theymusthavebeenexaminedandpassedduringthe12monthspriortonomination.•Eachthesisshouldincludeaforewordbythesupervisoroutliningthesignifi-canceofitscontent.•Thethese

7、sshouldhaveaclearlydefinedstructureincludinganintroductionaccessibletoscientistsnotexpertinthatparticularfield.Moreinformationaboutthisseriesathttp://www.springer.com/series/8790QingkeZhangInvestigationsonMicrostructureandMechanicalPropertiesoftheCu/Pb-freeSolderJointInt

8、erfacesDoctoralThesisacceptedbyUniversityofChineseAcademyofSciences,Beijing,China123AuthorSupervisorDr.QingkeZhangPro

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