纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)

纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)

ID:33008707

大小:2.29 MB

页数:42页

时间:2019-02-19

纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)_第1页
纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)_第2页
纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)_第3页
纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)_第4页
纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)_第5页
资源描述:

《纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库

1、哈尔滨理工大学工学硕士学位论文50nmCu颗粒的复合焊膏焊后剪切力降低程度较其它两种粒径的铜颗粒明显。关键词SnBi钎料;复合焊膏;纳米颗粒;微观组织;剪切性能-II-万方数据哈尔滨理工大学工学硕士学位论文StudyofModificationandMechanismofNano-ParticlesonSn58Bi/CuMicroSolderJointsAbstractInthedevelopmentprocessoflead-freesoldersinelectronicproducts,SnBisolderswaswidelyusedinthelow-temperaturep

2、ackaging,duetoitslowcost,lowmeltingpoint,lowthermalexpansioncoefficientandbettermechanicalproperties.However,SnBisoldersstillexistsomedisadvantagessuchaslowstrengthandhighbrittlenessetc.InordertooptimizethemicrostructureandpropertiesofSnBisolders,themechanicalmixingmethodwasusedtogetnanocompo

3、sitesolderpaste.Thispaperinvestigatedthemeltingcharacteristics,wettability,defectformationmechanism,microstructureandshearstrengthpropertiesofthecompositesolderpaste.Theresultsindicatedthattheadditionof3wt%ofnano-particlesintotheSn58Bisolderpasteresultedintheliquidustemperatureofnano-copperco

4、mpositesolderpasteandnano-nickelcompositesolderpasteincreasedby1.21and0.38℃comparedtotheSnBipaste,respectively.Themeltingrangeincreasedby1.16and0.33℃,respectively.Thespreadingcoefficientofcompositesolderpasteonthecoppersubstratewasdecreasedwiththeadditionofnano-particles.Thereasonwasthatthefl

5、uidityofthecompositesolderpastewasdecreasedintheprocessofmeltingduetoformationofhighmeltingtemperatureintermetalliccompounds.TheX-raythree-dimensionalandtwo-dimensionalimagingtechnologywasusedfordefectresearchafterreflow.Theresultsshowedthattheporosityincreasedwiththeincreaseofweightpercentof

6、nano-particles.Theporosityoccupiedhalfoftheareaofthesolderjointswhentheweightpercentofthecopperparticlesupto15%.Thecopperparticlesreactedwithtininthematrixintheprocessofmeltingandformedtheintermetalliccompounds.ThemeltingtemperatureoftheintermetalliccompoundswashigherthantheSnBimatrix.Thesold

7、erjointswithhighweightpercentcopperparticlesformedmoreintermetallic-III-万方数据哈尔滨理工大学工学硕士学位论文compounds,whichhinderedthespillofthegasproducedbytheflux.Asaresult,theporosityincreased.However,thecopperparticlesusedinthisstudybehavednoobvioussizeef

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。