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ID:33008707
大小:2.29 MB
页数:42页
时间:2019-02-19
《纳米颗粒对sn58bi2fcu微焊点的改性与机理分析-(6090)》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、哈尔滨理工大学工学硕士学位论文50nmCu颗粒的复合焊膏焊后剪切力降低程度较其它两种粒径的铜颗粒明显。关键词SnBi钎料;复合焊膏;纳米颗粒;微观组织;剪切性能-II-万方数据哈尔滨理工大学工学硕士学位论文StudyofModificationandMechanismofNano-ParticlesonSn58Bi/CuMicroSolderJointsAbstractInthedevelopmentprocessoflead-freesoldersinelectronicproducts,SnBisolderswaswidelyusedinthelow-temperaturep
2、ackaging,duetoitslowcost,lowmeltingpoint,lowthermalexpansioncoefficientandbettermechanicalproperties.However,SnBisoldersstillexistsomedisadvantagessuchaslowstrengthandhighbrittlenessetc.InordertooptimizethemicrostructureandpropertiesofSnBisolders,themechanicalmixingmethodwasusedtogetnanocompo
3、sitesolderpaste.Thispaperinvestigatedthemeltingcharacteristics,wettability,defectformationmechanism,microstructureandshearstrengthpropertiesofthecompositesolderpaste.Theresultsindicatedthattheadditionof3wt%ofnano-particlesintotheSn58Bisolderpasteresultedintheliquidustemperatureofnano-copperco
4、mpositesolderpasteandnano-nickelcompositesolderpasteincreasedby1.21and0.38℃comparedtotheSnBipaste,respectively.Themeltingrangeincreasedby1.16and0.33℃,respectively.Thespreadingcoefficientofcompositesolderpasteonthecoppersubstratewasdecreasedwiththeadditionofnano-particles.Thereasonwasthatthefl
5、uidityofthecompositesolderpastewasdecreasedintheprocessofmeltingduetoformationofhighmeltingtemperatureintermetalliccompounds.TheX-raythree-dimensionalandtwo-dimensionalimagingtechnologywasusedfordefectresearchafterreflow.Theresultsshowedthattheporosityincreasedwiththeincreaseofweightpercentof
6、nano-particles.Theporosityoccupiedhalfoftheareaofthesolderjointswhentheweightpercentofthecopperparticlesupto15%.Thecopperparticlesreactedwithtininthematrixintheprocessofmeltingandformedtheintermetalliccompounds.ThemeltingtemperatureoftheintermetalliccompoundswashigherthantheSnBimatrix.Thesold
7、erjointswithhighweightpercentcopperparticlesformedmoreintermetallic-III-万方数据哈尔滨理工大学工学硕士学位论文compounds,whichhinderedthespillofthegasproducedbytheflux.Asaresult,theporosityincreased.However,thecopperparticlesusedinthisstudybehavednoobvioussizeef
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