微组装关键工艺技术分析

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1、3.2.2芯片共晶原理...............................................................................................153.2.3影响芯片共晶的关键因素............................................................................163.2.4芯片共晶工艺的优缺点......................................................................

2、.........173.3芯片粘接工艺与共晶工艺的比较......................................................................183.3.1粘接和共晶材料电热机械性能比较...........................................................183.3.2芯片粘接工艺与共晶工艺适用范围...........................................................183.3.3本课题芯片互连工艺的选择........

3、...............................................................183.4芯片互连工艺失效模式、不良现象分析及解决方法......................................193.4.1失效模式分析................................................................................................193.4.2不良原因及相应措施..................................

4、..................................................213.5芯片共晶质量的检验内容及技术要求..............................................................223.5.1目检内容及技术要求...................................................................................223.5.2剪切力检测...........................................

5、........................................................223.5.3空洞率检测...................................................................................................223.6芯片共晶工艺开发及实验..................................................................................233.6.1芯片共晶要求.........

6、......................................................................................233.6.2开发所用设备Westbond7367E镊子共晶机参数调节设置.......................233.6.3实验情况.......................................................................................................243.6.4实验结果达标情况............

7、...........................................................................273.7芯片共晶工艺流程设计......................................................................................273.7.1设备、材料与工具的准备...........................................................................273.7.2陶瓷