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时间:2019-02-11
《【7A版】PCB面试英语试题.doc》由会员上传分享,免费在线阅读,更多相关内容在工程资料-天天文库。
1、7A版优质实用文档工程部英语考试试题姓名______________工号______________得分______________一、英汉互译:(每空2分,合计50分)MatteBlack__黑色阻焊__size______尺寸Scoring___V-CUT__Carbon___碳__space____间距_Dielectric__电介质_Basematerial___基材manufacture__产品______tracewidth__线宽peelablemask_________warpandtwist翘曲度__Silkscreen___丝印Co
2、rematerial_内层芯材Polytetrafluoetylene(PTFE)__聚四氟乙烯_______blindvia___盲孔______Buriedvia(hole)___埋孔______Paste贴片Cross-Section__过孔_______Immersiontin_________stackup_排层____外层线路__outerlayer__铜箔_Copperfoil___阻抗__Impedance______有铅喷锡__HASL(hotairlevelling)沉金____IMM_二、短句用英文翻译成汉语:(共50分)1.Un
3、lessotherwisespecified,dimensionsonthisdrawingandgerberdataareeGpressedinmils.(3分)译:除非另外说明,图纸和gerber文件中的尺寸的单位均为英制的2.WORKMANSHIPSPECIFICATION:ClassIIIperlatestissueofIPC-6012,IPC-600,andIPC-6011latestissue,unlessotherwisespecified.Annularringtobe1milminimum.Viapadsmaybetear-dropp
4、edtomeettheannularringrequirement.SoldermaskshallmeetIPC-600ClassIIthicknessrequirements.(5分)译:检验标准47A版优质实用文档7A版优质实用文档ClassIIIperlatestissueofIPC-6012,IPC-600,andIPC-6011latestissue除了另有说明。焊环最小1mil。过孔焊盘可以用泪滴去满足焊环要求。阻焊厚度要求必须满足IPC-600ClassII3.CrosssectiondetailspecifieseGpectednomi
5、nalthicknessesinmilsformaterialsusedinboardstackup.(3分)译:4.Minimum0.0010in.copperplatingrequiredinallplatedthroughholes.Outerlayercopperthicknesses。(3分)译:保证孔内铜厚最小40um。外层铜厚薄些5.FINISH:Hot-AirSolderLevel(HASL)perIPC-6012Aorlatestissue.Soldermaybe63/37Sn/Pbor60/40Sn/Pb.(3分)译:表面工艺热风整
6、平检验标准IPC-6012A或是最新的标准。锡铅比例63/37或60/406.Applysoldermaskoverbarecopper(SMOBC).Pb-freecompatibleanddarkgreencolor.ApprovedsoldermasksareTAIYOPSR-4000-G23K,TAIYOPSR-4000-Z26,Soldermasktobe0.4milsminimumatthekneeofcopper.(5分)译:阻焊用绿色的形号为TAIYOPSR-4000-G23K,TAIYOPSR-4000-Z26阻焊厚度最小0.4mil
7、s7.TheVIA_FILLlayershouldbeusedtodefinewhichviasaretobefilledNonconductiveepoGy.(5分)译:VIA塞孔用环氧阻焊47A版优质实用文档7A版优质实用文档8.BoardThickness(m62.7+/-10%NOTES:1.Prepregthicknessesof0.004"[0.1MM]orgreaterrequireaminimumof3plys,NumberofLayers6.(3分)译:板厚9.BoardMarkings:Markthepcbwiththedateco
8、deofproduction,manufacturer’slogoonsoldersideof
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