波峰焊接及其缺陷分析 毕业论文

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1、毕业设计论文作者学号系部机电学院专业题目波峰焊接及其缺陷分析指导教师评阅教师完成时间：毕业设计(论文)中文摘要22题目：波峰焊接及其缺陷分析摘要：波峰焊是指将熔化的软钎焊料（铅锡合金），经电动泵或电磁泵喷流成设计要求的焊料波峰，亦可通过向焊料池注入氮气来形成，使预先装有元器件的印制板通过焊料波峰，实现元器件焊端或引脚与印制板焊盘之间机械与电气连接的软钎焊，也可称为群焊或流动焊。这种焊接方法主要用于传统通孔插装工艺，以及表面组装与通孔插装元器件的混装工艺，适合波峰焊的表面贴装元器件有矩形和圆柱形片式元件、SOT以及较小的SOP器件等。本文通过介绍波峰焊的定义、工艺方式、过程分析、缺陷分

2、析等，提出波峰焊接的各种缺陷以及解决的各种方法。关键词：波峰焊缺陷分析22毕业设计(论文)外文摘要Title:WaveSolderingIntroductionandItsDefectAnalysisAbstract:Wavesolderingreferstothesoftmeltsolderingmaterial(leadtinalloy)，theelectricpumporelectromagneticpumpsprayflowintothedesignrequirementssolder，italsocanthroughpeakstoinjectnitrogentoformso

3、lderspool，withcomponentsinadvancebythewave，PCBsolderingweldingsideorofcomponentswithpinsPCBpadofmechanicalandelectricalconnectionbetweenthesoftbrazing，canalsobecalledgroupofweldingorflowwelding.Thiskindofweldingmethodismainlyusedintraditionalthrough-holecartridgeprocess，aswellassurfaceassemblya

4、ndthrough-holecartridgecomponentsfordualwavesolderingprocess，SMTcomponentsarerectangularandcylindricalelectroniccomponent，SOTandsmallerSOPdevices，etc.Thispaperintroducesthedefinition，wavesolderingprocessmethod，processanalysis，defectanalysisintheoperatingprocessandputsforwardthemethodsofsolderin

5、gdefectandsolvedallkindsofthesolderingdefects.Keywords:WaveSolderingDefectsAnalysis22目录毕业设计（论文）中文摘要···········································1毕业设计（论文）外文摘要···········································21引言······························································42波峰焊工艺························

6、································42.1波峰焊的定义················································42.2波峰焊的种类················································52.3波峰焊接原理················································63波峰焊组成及设备简介··············································83.1波峰焊机的组成····················

7、··························83.2波峰焊设备简介··············································94波峰焊流程及作用·················································105波峰焊中助焊剂的工艺方式·········································126波峰焊接工艺参数设置22及温度曲线解析··········