smt回流焊工艺中英文对照

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1、·SMT回流焊工艺中英文对照·1.FundamentalsofSoldersandSoldering（焊料及焊接基础知识）SolderingTheory（焊接理论）MicrostructureandSoldering（显微结构及焊接）EffectofElementalConstituentsonWetting（焊料成分对润湿的影响）EffectofImpuritiesonSoldering（杂质对焊接的影响）2.SolderPasteTechnology（焊膏工艺）SolderPowder(锡粉)SolderPasteRheolog

2、y（锡膏流变学）SolderPasteComposition&Manufacturing（锡膏成分和制造）3.SMTProblemsOccurredPriortoReflow（回流前SMT问题）FluxSeparation（助焊剂分离)PasteHardening（焊膏硬化）PoorStencilLife（网板寿命问题)PoorPrintThickness（印刷厚度不理想）PoorPasteReleaseFromSqueegee（锡膏脱离刮刀问题）Smear（印锡模糊）Insufficiency（印锡不足）NeedleCloggin

3、g（针孔堵塞）Slump（塌落）LowTack（低粘性）ShortTackTime（粘性时间短）4.SMTProblemsOccurredDuringReflow（回流过程中的SMT问题）ColdJoints（冷焊）Nonwetting（不润湿）Dewetting（反润湿）Leaching（浸析）Intermetallics（金属互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（桥连）Voiding（空洞）Opening（开路）SolderBalling(锡球)SolderBea

4、ding（锡珠）Spattering（飞溅）5.SMTProblemsOccurredatPostReflowStage（回流后问题）WhiteResidue（白色残留物）CharredResidue（炭化残留物）PoorProbingContact（探针测接问题）SurfaceInsulationResistanceorElectrochemicalMigrationFailure（表面绝缘阻抗或电化迁移缺陷）Delamination/Voiding/Non-curingOfConformalCoating/Encapsulant

5、s（分层/空洞/敷形涂覆或包封的固化问题）6.ChallengesatBGAandCSPAssemblyandReworkStage（BGA、CSP组装和翻修的挑战）StarvedSolderJoint（少锡焊点）PoorSelf-Alignment（自对位问题）PoorWetting（润湿不良）Voiding（空洞）Bridging（桥连）UnevenJointHeight（焊点高度不均）Open（开路）PopcornandDelamination（爆米花和分层）SolderWebbing（锡网）SolderBalling（锡球）

6、7.ProblemsOccurredatFlipChipReflowAttachment（倒装晶片回流期间发生的问题）Misalignment（位置不准）PoorWetting（润湿不良）SolderVoiding（空洞）UnderfillVoiding（底部填充空洞）Bridging（桥连）Open（开路）UnderfillCrack（底部填充裂缝）Delamination（分层）FillerSegregation（填充分离）InsufficientUnderfilling（底部填充不充分）8.OptimizingReflowPr

7、ofileviaDefectMechanismsAnalysis（回流曲线优化与缺陷机理分析）FluxReaction（助焊剂反应）PeakTemperature（峰值温度）CoolingStage（冷却阶段）HeatingStage（加热阶段）TimingConsiderations（时间研究）OptimizationofProfile（曲线优化）ComparisonwithConventionalProfiles（与传统曲线的比较）Discussion（讨论）ImplementingLinearRampUpProfile(斜坡式

8、曲线)