半导体封装及外形尺寸

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1、半导体封装及外形尺寸

2、第1lun14-NOV-03DPAK369A-1321.0ab21-NOV-03DPAKSingleGaugeSurfaceMount369C27.0null21-NOV-03DPAKSingleGaugeInsertionMount369D27.0null24-NOV-03SMC403-0323.0b14-NOV-03SMB403A-0327.0d14-NOV-03SMA403B-0128.0o14-NOV-03SMB403C-0121.0o14-NOV-03SMA403D-0118.0o14-NOV-03SMA403D-0219.0A14-NOV-

3、03SC-70(SOT-323)419-0419.0L14-NOV-03SC-88A(SOT-353)419A-0122.0E14-NOV-03SC-88A(SOT-353)419A-0227.0G18-NOV-03SC-88(SOT-363)419B-0227.002T19-NOV-03SC-82419C-0120.0a26-NOV-03MOSORB41A-0224.0a29-APR-03MOSORB41A-0417.0D29-APR-03SOD-123425-0426.0c14-NOV-03D3PAK433-0133.0d29-APR-03POITE457-0428.0

4、d14-NOV-03TopCanButton460-0223.002B14-NOV-03SC-75(SC-90,SOT-416)463-0128.0b14-NOV-03SC-89463C-0227.0B14-NOV-03SOD-323477-0220.0b24-NOV-03SOT-23/TSOP-548326.002C24-NOV-03QFN485AA26.0null11-NOV-0324PINMLF485F-0128.0O29-APR-03QFN3x3mm,16PIN485G-0120.0O14-NOV-03QFN7x7mm,32PIN485J-0225.0014-NOV

5、-03QFN7x7mm,48PIN485K-0226.0B14-NOV-03QFN4x4mm,24PIN485L-0122.0014-NOV-03null485M22.001O25-NOV-03QFN3x3x0.9mm,12PIN485N18.001O18-NOV-03QFN2x2mm,6PIN488-0218.0A09-SEP-03FCBGA489-0124.0029-APR-0310PINFLIP-Chip489AA23.001O26-NOV-03QSOP-16492-0126.0O18-NOV-03QSOP24492B-0130.0014-NOV-03US8493-0

6、124.0O18-NOV-03SON-6494-0119.0030-OCT-03POicroLeadless3PADS496A22.002A14-NOV-03SOD-123FL49822.01o14-NOV-039PINFLIPCHIPCSP499E25.0null27-NOV-03POinusPin#6)626A-0127.0014-NOV-03PDIP7(MinusPin#7)626B32.001A14-NOV-03CDIP632-0837.0y29-APR-03PDIP646-0636.0m27-NOV-03PDIP648-0835.0r20-NOV-03PDIP64

7、8C-0441.0d14-NOV-03PDIP648E-0141.0o14-NOV-03PDIP707-0226.0d14-NOV-03PDIP709-0225.0d14-NOV-03PDIP711-0328.0d14-NOV-03PDIP724-0338.0d14-NOV-03CDIP732-0335.0e29-APR-03PDIP738-0336.0e14-NOV-03SOIC751-0638.0null27-NOV-03SOIC751-0728.0AA25-NOV-03SOIC751A-0338.0f27-NOV-03SOIC751B-0541.0j25-NOV-03

8、SOIC751D-0544.0f26-NOV-03SOIC751E-0440.0e14-NOV-03SOIC751F-0531.0g14-NOV-03SOIC751G-0339.0b26-NOV-03SO-16751K-0124.0o14-NOV-03SOIC-16icro-10846B-0222.0214-NOV-03MICRO-8LEADLESS846C-0123.0o14-NOV-0364LeadExposedPadLQFP848G46.002A14-MAR-03LQFP52LEADEXPOSEDPAD848