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1、芯片焊锡工程能力分析本人精心整理的文档,文档来自网络本人仅收藏整理如有错误还请自己查证！芯片焊锡工程能力分析沈泽斌三星电子(苏州)半导体有限公司摘要:SMT技术已经在电子组装技术中广泛运用,随着SMT的进一步发展使电子产品向更高小型化和更高超的性能发展,也导致需要增加环路密度和有关可靠性的提高.然而,芯片产品的焊锡的工程能力-对于SMT生产更小电子产品流程有着致关的重要性.通过本人在生产实践中一系列的研究以后,对于镀层(镍&锡)厚度和强度对芯片的电特性有着密切的关系.在本论文中中,对焊锡的工程能力和焊接情况的用
2、实验加以证明.此外,焊锡在不同情况下对工程中焊锡发生偏移也是评价内容之一.实验评价的结果显示覆镀厚度对焊锡-工程能力是最为重要的参数.Chipsolder-abilityanalysiszebin.shenSamsungElectronics（SUZHOU）SemiconductorAbstract:SMTisusedasanupdatedelectronicassemblytechnology,itmakeselectronicproductsmovetowardshigherminiaturizationa
3、ndhigherperformance,leadstoincreasedcircuitdensityandhighdemandsonreliability.Devicesolder-abilityiscriticaltotheprocessofSMT,whichimpactstheelectricpropertiesofelectronicproducts.Afteraseriesofstudies,theparametersofchipplating(Nickel&Tinfilm)thicknessandcu
4、rrentintensitymayhaverelationtosolderingsystem.Inthispaper,theviewpointhasbeendemonstratedbyevaluationofsolderabilityandsolderingperformance.Inaddition,testofpullbackabilitywhenmisalignmentisalsooneoftheevaluatingpoints.Resultoftheevaluationshowthatchipplati
5、ngthicknessisamostimportantparametertoSolder-abilitysystem.正文1.PrologueSolderingsystemisasubstantialpartduringthechymistcompatibilityprocess.Thedefinitionofthesolderingsystemisrefertoallthechemicmaterialssuchassolderpaste,solderingflux,deviceandsoon.Themetal
6、whichcouldsoldering,suchascopper、nickel、gold、silveretc,thesemetalwillquicklyformafilmwithsoldersimilarlytoakindofcompoundcalledIntermetalliccompound(IMC)whenathightemperature.Atthemomentofthefusedtincontactwithcopper,solderwettingwouldhappen.Tinatomsimmediat
7、elydiffusetothecopperfilmandatthesametimecopperatomsdiffusetothetinfilm,ontheircommonboundaryIMCofCu6Sn5wasformed.DependingonIMCalldevicesarejointedwithpadonPCB.Chipsolder-abilityisaportionofsolderingsystemandisalsotheemphasisinthispaper.Consideringthethickn
8、essofplatingfilmsandplatingcurrentcondition,largequantitiesofexperimentsandtestsareorganizedtoevaluatechipsolder-ability.Solderperformance、solderjointstrengthandthereversionabilityaftermisalignm
