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1、微电路组装、三维立体组装（Microcircuitassemblyand3Dsolidassembly）Microcircuitassembly,3Dassembly,theUniversityofBelgiumMicroassemblytechnologyMicropackagingtechnologyTheheatoftheheatsourceiscirculatedrapidlytothesurroundingenvironmentbymeansofheattransfer,convection,heattransferandradiation.Thecoolingmethod
2、sarecommonlyused:naturalcooling(includingconductioncooling,naturalconvectioncoolingandheatradiation),forcedaircoolingandliquidcooling,evaporativecooling,thermoelectricrefrigeration(semiconductorrefrigeration),heattransferetc..Thechoiceofcoolingmethoddependsmainlyontheheatingpowerdensityandtheal
3、lowabletemperatureriseofthecomponentsorequipment.Usingthesubstratematerialanddielectricmaterialwithgoodheatdissipation,theweldingqualityofeachelectrodeinthecomponentcanbeimproved,anditsinternalthermalresistancecanbereduced.WeizuzhuangJishu(micropackagingtechnol.microassemblytechnology,weldingte
4、chnologyandmicro)isanintegratedtechnologybasedassemblyprocesstechnologyassemblywithmicroelectronicstechnology,highdensity,themultilayerwiringboard,inaccordancewiththeelectricalprinciplediagram,microelectronicdeviceandmicrocomponentsassembledintoatechnologyofelectronichardware.Itrelatestosolidst
5、atetechnology,thinfilmtechnology,thickfilmtechnology,microcircuittechnology,interconnectionandmicroweldingtechnology,heat-798-microcontroltechnology,highdensityassemblytechnology,testingtechnology,reliabilitytechnologyandcomputeraidedengineering,isacomprehensivetechnologyofacloselyintegratedcir
6、cuit,structure,process,materials,components,etc.the.Theelectronicassemblytechnologyhasgonethroughthefollowingstages:1.In40s,itwasamanualweldingstagewithelectronictubesasactivedevices.In40s,transistorsandprintedcircuitcameoutinsuccession,andhadbeenwidelyappliedfrom50sto60s.Afterthat,themanualwel
7、dingstage,mainlywithtransistorsandprintedcircuitboards,wasformed.Atthisstage,theassemblyandstructureoftheelectronicequipmenthavebeengreatlychanged,sothattheassemblydensityhasbeenimprovedandthevolumeoftheequipmenthasbeenreduced.In6
