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1、手机pa及pcb板ansys热分析(ANSYSthermalanalysisofmobilephonePAandPCBboard)ThispaperiscontributedbywalkingcludPdfdocumentsmayexperiencepoorbrowsingontheWAPside.ItisrecommendedthatyouselectTXTfirstordownloadthesourcefiletothelocalmachine.Theoreticalanalysisandapplicationoft
2、hermaldesignofmobilephonePAandPCBboard(PASSIONRFSOS)[keyword]mobilePCBthermaldesignHYFSOFTFigure2.1infraredPAheatingsignalWARECO[Abstract]mobilephonePAisveryimportantforthewholetransmittingcircuit,notonlybecauseofitsemissionindex,emissionperformancehasgreateffect
3、andPAcurrentconsumptionaccountedfornearly60%oftotalcurrentmobilephone,becauseofitslowefficiency,mostoftheenergytobedissipatedaway,oneofthemainsourceofwhichisPAmobilephonefever.PAapplicationsbothontheemissionperformanceimprovement,thecurrentconsumptiontoimprovethe
4、calltime,orbecausetheheatdissipationofPAandPCBinrelationtothethermaldesignandthecomponentshavegreateffect.Thispapermainlydescribesfromtheaspectsofheattransfer,throughsomeofthebasictheoryandmethodofthermaldesign,thermalthedesignofthePCBboardandputforwardsuggestion
5、sforimprovementandanalysisofmobilephoneL.TDFig.2.2heatingcurveofPAatdifferentpowerThetheoreticalbasisof1.1thermaldesignAsmallervolumeofportableproductspopularnowthemainthermaldesignchallenges,closedstructurenoflowofair,thepowerconsumptiondevicesbecomesmaller,than
6、thetraditionalHeatSinks.sothethermaldesignmainlyishowtogetridofthetraditionalHeatSinks.howtomakeeffectivePCBdesigntosolveonlyasmallpackage.ThesmallerPOWERPADheatdissipationproblemoflargepowerconsumptionofICandinfluencethetemperature.Theheattransferismainlydivided
7、into,heatconduction,heatconvection,heatradiationandheatconduction.Mainlythroughdirectheatconductionbetweenthematerialtransfer.FormobilephonePCB,PAmainlyheatlargehorizontalordevicebyPCBthelongitudinalheatconduction.Directthermalconvectionheattransferfromthesurface
8、tothestationaryormovingair.ButbecausethemobilephonePCB,ashieldofPAPMdevices,theairinthehoodAstaticstate,sothemobilephoneandPCBboard,mostlystaticmethods.Thether