手机pa及pcb板ansys热分析(ansys thermal analysis of mobile phone pa and pcb board)

手机pa及pcb板ansys热分析(ansys thermal analysis of mobile phone pa and pcb board)

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时间:2018-08-02

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1、手机pa及pcb板ansys热分析(ANSYSthermalanalysisofmobilephonePAandPCBboard)ThispaperiscontributedbywalkingcludPdfdocumentsmayexperiencepoorbrowsingontheWAPside.ItisrecommendedthatyouselectTXTfirstordownloadthesourcefiletothelocalmachine.Theoreticalanalysisandapplicationoft

2、hermaldesignofmobilephonePAandPCBboard(PASSIONRFSOS)[keyword]mobilePCBthermaldesignHYFSOFTFigure2.1infraredPAheatingsignalWARECO[Abstract]mobilephonePAisveryimportantforthewholetransmittingcircuit,notonlybecauseofitsemissionindex,emissionperformancehasgreateffect

3、andPAcurrentconsumptionaccountedfornearly60%oftotalcurrentmobilephone,becauseofitslowefficiency,mostoftheenergytobedissipatedaway,oneofthemainsourceofwhichisPAmobilephonefever.PAapplicationsbothontheemissionperformanceimprovement,thecurrentconsumptiontoimprovethe

4、calltime,orbecausetheheatdissipationofPAandPCBinrelationtothethermaldesignandthecomponentshavegreateffect.Thispapermainlydescribesfromtheaspectsofheattransfer,throughsomeofthebasictheoryandmethodofthermaldesign,thermalthedesignofthePCBboardandputforwardsuggestion

5、sforimprovementandanalysisofmobilephoneL.TDFig.2.2heatingcurveofPAatdifferentpowerThetheoreticalbasisof1.1thermaldesignAsmallervolumeofportableproductspopularnowthemainthermaldesignchallenges,closedstructurenoflowofair,thepowerconsumptiondevicesbecomesmaller,than

6、thetraditionalHeatSinks.sothethermaldesignmainlyishowtogetridofthetraditionalHeatSinks.howtomakeeffectivePCBdesigntosolveonlyasmallpackage.ThesmallerPOWERPADheatdissipationproblemoflargepowerconsumptionofICandinfluencethetemperature.Theheattransferismainlydivided

7、into,heatconduction,heatconvection,heatradiationandheatconduction.Mainlythroughdirectheatconductionbetweenthematerialtransfer.FormobilephonePCB,PAmainlyheatlargehorizontalordevicebyPCBthelongitudinalheatconduction.Directthermalconvectionheattransferfromthesurface

8、tothestationaryormovingair.ButbecausethemobilephonePCB,ashieldofPAPMdevices,theairinthehoodAstaticstate,sothemobilephoneandPCBboard,mostlystaticmethods.Thether

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