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《表面处理之osp及化学镍金（osp and electroless nickel gold for surface treatment）》由会员上传分享，免费在线阅读，更多相关内容在教育资源-天天文库。
1、表面处理之osp及化学镍金（OSPandelectrolessnickelgoldforsurfacetreatment）Thispapercontributedbyanncen.DocdocumentmayattheWAPendofthebrowsingexperiencepoor.SuggestyouselectTXT,ordownloadthesourcefiletothemachineview.OSPandchemicalnickelgoldsurfacetreatmentThe14.1tinleadlongplayedtoprotectcoppersurfaces,
2、maintainweldingcharacterfromthemoltentintoHASL,dozensofyearssofar,severaldifficultproblemscannotbeovercome,havetousethealternativeprocesscannotbetoosmall:A.Pitch(bridging)causedbybridgingB.weldingflattodayYanC.COB(chiponboard)inD.isusedtodesigntheenvironmentalpollutioninthischapteronthetwom
3、ostcommonlyusedOSPprocessandchemicalnickelgoldintroduced14.2OSPOSPOrganicSolderabilityPreservatives,translatedasorganicsolderabilitypreservationfilm,alsocalledcopperprotectingagent,PrefluxEnglishsaid,thischapteristoprotectcopperagentcall.14.2.1A.BTA(theintroductionofspeciesandthreebenzo:BEN
4、ZOTRIAZOLEBTAbenzamine)isyellowishwhitewiththeodorlesscrystallinepowder,inhydrochloricacidareverystable,andlesspronetotheredoxreaction,canformstablecompoundswithmetal.ENTHONcanbedissolvedinmethanolandwatersolutionforsale,asthecoppersurface(TARNISHANDOXIDERESIST)antioxidants,marketedasCU-55a
5、ndCU-56,afterCU-56treatmentofcoppersurfacecanproduceaprotectivefilmtopreventtherapidoxidationofbarecopper.Theoperationprocessisshownintable14.1.B.AIALKYLIMIDAZOLEPREFLUX(alkylimidazolium)isattheearlystageofALKYLIMIDAZOLEasprotectingagentofcopper,thegoodsfirstdevelopedbyJapanChemicalCompany,
6、patentedin1985,usedforetchingphotoresist(ETCHINGRESIST),butthecoloristransparentdetectionisnoteasy,notalotofuse.ThelaunchofGLICOAT,thederived.GLICOAT-SMD(E3)withthefollowingcharacteristics:-maintaingoodcompatibilitywithflux,solder-resistanttoheatsolderingprocesstopreventcoppersurfaceoxidati
7、onprocessasshownintable14.2.C.ABI(alkylimidazole)ALKYLBENZIMIDZOLEdevelopedbyJapanandthreecompanies,thenameCUCOATA,isawettypecopperprotectiveagent.Withthecopperatomcomplexes(COMPLEXCOMPOUND),topreventthecopperoxide,arecompatiblewithallkindsofsolderpaste,
