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1、AcronymsforSEQSSMClassGeneralAcronyms4MEP–Machines,Materials,Measurements,Methods,Environment,People.Generalcausecategories.Alsoknownas5M’sor6M’s.AIAG–AutomotiveIndustryActionGroup.AMF–(Dell)AmericasManufacturingFacility.IncludesfactorieslocatedinAustin,Nashville,andNorthCarolinaAPCC–(
2、Dell)Asia-PacificCustomerCenter.FactorylocatedinPenang,MalaysiaAVL–ApprovedVendorList.SometimesASL(ApprovedSuppliersList).SomeinterchangewithBOM(BuildofMaterialsorBillofMaterials),butBOMisdifferentthanAVL/ASL.BC–BusinessContract.BPI–BusinessProcessImprovement.Dell’sQualityphilosophy,wh
3、ichincludesSixSigmatoolsandpractices,LeanTechnologyprinciples,andotheraspectsofQualityImprovement.BST–BusinessStrategyTeam.CA–CorrectiveAction.CCC–(Dell)ChinaCustomerCenter.FactorylocatedinXiamen,ChinaCE–CustomerExperience.CIP–Continual(orContinuous)ImprovementProcess.COC–CenterofCompe
4、tency.COS–ContinuityofSupply.CTQ–CriticaltoQuality,usuallyreferringtocharacteristicsoftheproductorprocess.CLCA–ClosedLoopCorrectiveAction.Amethodologyofcharacterizing,containing,resolvingandreportingspecialcauseeventsinaprocess.DES/DID–Design-InducedDamage.DFSS–DesignforSixSigma.DFX(or
5、DFx)–DesignforX,oftencalled“DesignforEverything.”TypesofX’esinclude:Cost,Quality,Reliability,Manufacturing,Test,Service,SixSigmaDVT–DesignValidationTesting.E2E–EndtoEnd,referringtoatypeofprocessflowchartormap.EBST–ExecutiveBusinessStrategyTeam.ECN–EngineeringChangeNotification.ECO–Engi
6、neeringChangeOrder.EICC–ElectronicsIndustryCodeofConduct.EMF–(Dell)EuropeManufacturingCenter.FactorylocatedinLimerick,Ireland.WillincludenewfactoryinPolandinthenearfuture.EOL–EndofLife.Theendofwarrantyobligations(typicallythesameasEOSL).EOPL–EndofProductionLife.Dellfactorystopsmanufact
7、uring.EOS–ElectricalOverStress.EOSL–EndofServiceLife.Dellstopsservicing(typicallywhenwarrantyperiodcomplete).ESD–ElectroStaticDischarge.EVT–EngineeringValidationTesting.FA–FailureAnalysis.FAI–FirstArticleInspection.FIFO–FirstInFirstOut.FMEA–FailureModeEffectsAnalysis.FPM–FunctionalPr
