igbt模块的寿命和可靠性研究

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1、IGBT模块的寿命和可靠性研究系统寿命与可靠性关系：可靠性：产品在一定条件下无故障完成规定功能的能力或可能性 IGBT模块的失效模式：功率周次Powercycling：功率周次用于评估绑定线和Die焊层的机械寿命Powercyclingcanestimatethebondingwireanddiesolder’slifetimep测试方法:加载自加热，周期≤3秒，测试ΔTvjpTestmethod:Selfheatingbyload,T_cycle≤3seconds,measureΔTvjp失效判据：饱和压降Vcesat增大

2、+5%pFailurecriteria:Vcesatincreasemorethan5%温度周次Thermalcycling温度周次用于评估DCB下焊接层的寿命ThermalcyclingcanestimateDCBsolder’slifetimep测试方法:通电加热，周期5分钟，测量ΔTcpTestmethod:Selfheatingbyload,5min/,measureΔTcp失效判据：热阻Rthjc增大+20%pFailurecriteria:R_thjcincrease20%失效机理是两种材料不同的膨胀系数(Dif

3、ferentmaterial’sCTE)[ppm/K]不同应用下IGBT模块的寿命LifetimeofIGBTmoduleindifferentapplicationTherearemanyapplicationsandsimilartypesofpowermodules.Mainobjectiveis:howtoselectanactivedeviceinordertoreachdesiredsystemlifetime?Isitpossibletohavepowermodulesuitingtoallapplicatio

4、ns?由周期内系统工况变化获得温度变化Getthetemperatureprofilebypowerprofileinacycle温度变化导致的失效模式FailuremodeswithΔTTherearetwokeyfactorsintheselectionoftheappropriatepowermodule:1)thermal:Tvjop

5、curvesandthermalstressesNote:RBSOAandotherelectricalphenomenaarenotcoveredinthepresentation.Factorsandimpacts:1)TjFWDmax≤TvjopTjIGBTmax≤TviopNowadaysTvjop=150°C2)DTjFWD&DTjIGBTrefertoPowerCyclingreliabilitycurvesΔTCreferstoThermalCyclingreliabilitycurvesReliability

6、curvesarealwaysgivenbypowermodulemanufacturer绑定线老化——功率周次曲线Bondwiredegradation–PCcurve功率周次曲线修正因数PCcurvecorrectionfactor基板焊层老化——热循环曲线Solderonbaseplatedegradation–TCcurve功率温度循环（PC）次数评估计算No.ofcycleestimationcalculationwithPowercyclingcurve实例：稳态周期系统的寿命估算Simplemissioncyc

7、le--exampleoflifetimeestimationForrelativesimplemissioncyclesthemodulelifetimebasedonthethreepresentedreliabilitycurvesandpowerlossesconvertedintoajunctionandcasetemperatureswingcanbeeasilyestimated.PrimePACK™moduleinuse:FF900R12IP4D实例：稳态周期系统的寿命估算Simplemissioncycle

8、--exampleoflifetimeestimationQuestionfromlastpage:howtoestimatethepowermodulelifetimeunderthemissioncycle,hastoberepeatedagain.Let’scalculatethem