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ID:62484326
大小:9.03 KB
页数:4页
时间:2021-05-09
《IC封装大全及世界各大品牌.docx》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、IC封装介绍BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevisionCPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO22OFlatPackHSOP2
2、8QFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageSOJ32LSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETA
3、LQUAD100LPQFP100LQFPQuadFlatPackageSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterTO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig
4、-ZagInlinePackageTEPBGA288LTEPBGA288LC-BendLead?CERQUADCeramicQuadFlatPackCeramicCaseLAMINATECSP112LChipScalePackageGullWingLeads?J-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsLLP8LaPCI32bit5VPeripheralComponentInterconne
5、ctPCI64bitLAMINATETCSP20LChipScalePackageTO252TO263/TO268SODIMMSmallOutlineDualInlineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPent
6、iumCPUPeripheralComponentInterconnectPCMCIAPDIPPLCCPS/2PS/2mouseportpinoutSIMM30SIMM30PinoutSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAFo
7、rAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOHICBrand
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