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ID:40564501
大小:839.70 KB
页数:8页
时间:2019-08-04
《A_Review_of_RESURF_Technology》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、15P50'ZOOO.MayZZ25.Toulouse.FranceAReviewofRESURFTechnologyAdriaanW.LudikhuizePlulipsResearch,Eindhoven,TheNetherlandsFax+3I402743390.e-mailAdriaan.Ludikhuize@philips.comABSTRACTandpossiblelateralbreakdown,oneverticaldiodewithRESURF(ReducedSurfaceField)technologyisoneoftheh
2、orizontaln-/p-boundaryandpossibleverticalthemostwidely-usedmethodsforthedesignoflateralbreakdown.high-voltage,lowon-resistancedevices.ThetechniqueForathick(50pm)epitaxiallayerthebreakdownvolt-hasallowedtheintegrationofHVdevices,rangingfromageis470V([2]:370V)andthemaximumfie
3、ldisatthe20Vto1200V,withbipolarandMOStransistors.surfaceatthen-/p+junction(Fig.2a).Foramuchthin-Atechnicalreviewisgivenonthetechnologyasdevel-nerepitaxiallayer(15pm)thelateraldepletionlayerisopedduringthelast20years.Thepaperdiscussestheinfluencedbythedepletionlayerofthevert
4、icaln-/p-inventionanditsapplicationindiscretedevices,injunctionandthesurfacefieldisreduced:a2D-effect.AtJunction-IsolatedIC'sandSOI,andasMultipleResurf.thelughervoltageof1150V(Fig.2b)thefieldatthesur-Itincludesanevaluationoftopicslikebreakdown,on-facehas2peaks,oneoriginatin
5、gfromthen-/p+junctionresistance,hgh-sideandhigh-currenteffectsandreli-andanotherjustbelowthesurfaceatthecurvatureoftheability.n+/n-junction,withamoderatefieldinbetween.Ifthelateraldistanceissufficient,breakdownoccursnowI.KNVENTIONOFTHERESURFPRINCIPLEverticallyinthesemicondu
6、ctorbodyunderthen+re-Ahigherbreakdownvoltageinverticaldevicesusuallygion.requiresathickerandlowerdopedepitaxiallayer.How-ever,inexperimentalICsampleswithalateralisolationdiffusion,amuchhigherbreakdownvoltageisobtainedonathinnerlayer:herethesurfacefieldattheisolationjunction
7、isdecreasedby2-Ddepletion.ThisReducedSurfaceField(RESURF)effecthasanoptimumatatop-layerdoseQ/qofabout1.10l2at/cm2.AnintegrableLDMOSwithsurprisinglyhigh300Vbreakdownonthickepitaxywasobservedalreadyin1972[I].A400V.-_---(DSA-)LDMOSwithapincheddrainextensionwasreportedin1978[IA
8、];this'self-isolation'technologyisrelatedtoCMOSandhasbeenworkedoutandappliedmainly
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