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1、ReliabilityofMicrotechnologyJohanLiulOlliSalmelalJussiSa¨rkka¨JamesE.MorrislPer-ErikTegehallCristinaAnderssonReliabilityofMicrotechnologyInterconnects,DevicesandSystemsJohanLiuJamesE.MorrisSMITCenterandBionanoSystemsDepartmentofElectrical&ComputerLaboratoryEngineeringDe
2、partmentofMicrotechnologyPortlandStateUniversityandNanoscienceP.O.Box751,PortlandChalmersUniversityofTechnologyOR97207-0751Kemiva¨gen9,SE-41296Go¨teborgUSASwedenjmorris@cecs.pdx.eduandKeyLaboratoryofNewDisplaysPer-ErikTegehallandSystemIntegrationSwereaIVFSMITCenterandSc
3、hoolBox104,SE-43122Mo¨lndalofMechatronicsandMechanicalSwedenEngineeringper-erik.tegehall@swerea.seBox282,Room316,MechatronicsBuilding,ShanghaiCristinaAnderssonUniversityDepartmentofMicrotechnologyNo149,YanChangRoadandNanoscienceShanghai200072,ChinaChalmersUniversityofTe
4、chnologyjliu@chalmers.seKemiva¨gen9,SE-41296Go¨teborgSwedenOlliSalmelacristina.andersson@chalmers.seNokiaSiemensNetworksLinnoitustie6,FI-02600EspooFinlandolli.salmela@nsn.comJussiSa¨rkka¨NokiaSiemensNetworksKaapelitie4,FI-90620OuluFinlandjussi.sarkka@nsn.comISBN978-1-44
5、19-5759-7e-ISBN978-1-4419-5760-3DOI10.1007/978-1-4419-5760-3SpringerNewYorkDordrechtHeidelbergLondonLibraryofCongressControlNumber:2011920685#SpringerScience+BusinessMedia,LLC2011Allrightsreserved.Thisworkmaynotbetranslatedorcopiedinwholeorinpartwithoutthewrittenpermiss
6、ionofthepublisher(SpringerScience+BusinessMedia,LLC,233SpringStreet,NewYork,NY10013,USA),exceptforbriefexcerptsinconnectionwithreviewsorscholarlyanalysis.Useinconnectionwithanyformofinformationstorageandretrieval,electronicadaptation,computersoftware,orbysimilarordissim
7、ilarmethodologynowknownorhereafterdevelopedisforbidden.Theuseinthispublicationoftradenames,trademarks,servicemarks,andsimilarterms,eveniftheyarenotidentifiedassuch,isnottobetakenasanexpressionofopinionastowhetherornottheyaresubjecttoproprietaryrights.Printedonacid-freepa
8、perSpringerispartofSpringerScienceþBusinessMedia(www.springer.com)ForewordAsasociety,ourdependencyonelectronic
