Springer.IMANAKA.Y.Multilayered.Low.Temperature.Cofired.Ceramics.(LTCC).Technology.(SPRINGER.2005;.260.p)

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1、MultilayeredLowTemperatureCofiredCeramics(LTCC)TechnologyThispageintentionallyleftblankMultilayeredLowTemperatureCofiredCeramics(LTCC)TechnologyYoshihikoImanakaFujitsuLaboratories,Ltd.JapanSpringereBookISBN:0-387-23314-8PrintISBN:0-387-23130-7©2005SpringerScience+B

2、usinessMedia,Inc.Print©2005SpringerScience+BusinessMedia,Inc.BostonAllrightsreservedNopartofthiseBookmaybereproducedortransmittedinanyformorbyanymeans,electronic,mechanical,recording,orotherwise,withoutwrittenconsentfromthePublisherCreatedintheUnitedStatesofAmerica

3、VisitSpringer'seBookstoreat:http://ebooks.springerlink.comandtheSpringerGlobalWebsiteOnlineat:http://www.springeronline.comThisbookisdedicatedtoALLIlove.ThispageintentionallyleftblankContentsDedicationvListofFiguresxiListofTablesxxvPrefacexxixAcknowledgmentsxxxi1.I

4、ntroduction11.1Briefhistoricalreview21.2Typicalmaterial41.3Typicalmanufacturingprocess41.4Typicalproducttypes51.5CharacteristicsofLTCC61.5.1Highfrequencycharacteristics61.5.2Thermalstability9(lowthermalexpansion,goodthermalresistance)1.5.3Integrationofpassivecompon

5、ents101.6Trendsinmaterialsdevelopedbyrelevantcompanies111.7Subjectofthebook12References16Part1Materialtechnology192.Ceramicmaterial212.1Introduction212.2Lowtemperaturefiring232.2.1Fluidityofglass242.2.2Crystallizationofglass262.2.3Foamingofglass332.2.4Reactionbetwe

6、englassandceramic362.3Dielectriccharacteristics362.3.1Dielectricconstant362.3.2Dielectricloss412.4Thermalexpansion422.5Mechanicalstrength45viiiMultilayeredLTCCTechnology2.5.1Strengtheningtheglassphase472.5.2Thermalshockresistance512.6Thermalconductivity54References

7、553.Conductingmaterial593.1Introduction593.2Conductivepastematerials613.3Metallizationmethodsforaluminaceramics623.3.1Thickfilmmetallization623.3.1.1Hightemperatureprocesstype62(Mo-Mnmethod)3.3.1.2Lowtemperatureprocesstype633.3.2Cofiringmetallization643.3.2.1Metall

8、izationforHTCC663.4Conductivity663.5Suitabilityforco-sintering683.6Adherence723.7Migrationresistance743.8Bondability78(solderwetabilityandwirebon