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ID:33101175
大小:7.70 MB
页数:67页
时间:2019-02-20
《银纳米线的制备与其在导电胶中的应用》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、Abstractshownthatusingthelargepartlclessilverpowderasthemainfillingmaterialsandaddingacertainamountofsilvernanorodandsilvernanowirecanimprovetheconductivity.Becausethesilvernanorodscanbefilledinthegapofsilverflakeandbeusedasashortrideassociatedconductivepaths,toincreaseconductivepathsandformthecondu
2、ctivenetwork.Itcanhelptoreducethevolumeresistivityofconductiveadhesive.Thenanoparticlescanbefilledinanon-contactareaofsilverflakeandnanorods,anditwillmakemoreperfectconductivenetwork,therebyreducingthevolumeresistivityofconductiveadhesive.Keywords:silvernanowires,silvernanoparticles,polyolreductionm
3、ethod,conductiveadhesive-III-万方数据目录目录摘要..................................................................................................................IABSTRACT........................................................................................................II第1章绪论...........................
4、........................................................................11.1课题背景及研究的目的和意义..........................................................11.2银纳米材料的研究现状.....................................................................21.3银纳米材料的制备与应用.......................................................
5、..........31.3.1银纳米材料的制备方法.....................................................................31.3.2银纳米材料的应用............................................................................51.4导电胶概述........................................................................................71.4.1导电胶简介.......
6、.................................................................................71.4.2导电胶研究进展................................................................................91.5本文的主要研究内容........................................................................11第2章实验原理及表征方法...........................
7、..............................................122.1银纳米结构的制备机理与方法........................................................122.1.1合成原理.....................................................................
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