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ID:32122100
大小:4.51 MB
页数:50页
时间:2019-01-31
《镀铜陶瓷基板制备与某某封装应用-研究》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、华中科技大学硕士学位论文目录摘要.........................................................................................................................................IAbstract............................................................................................................
2、........................III1绪论1.1电子封装技术.................................................................................................................11.2大功率LED封装散热技术............................................................................................41.3散热基板简介
3、.................................................................................................................61.4课题来源及本文研究内容...........................................................................................112直接镀铜陶瓷基板制备2.1引言.................................
4、..............................................................................................132.2DPC基板制备工艺........................................................................................................152.3DPC制备中金属层粘附强度改善......................................
5、..........................................172.4不同镀铜液体系下镀铜研究.......................................................................................222.5表面金层沉积方式及结合特性...................................................................................242.6本章小结..............
6、.........................................................................................................273直接镀铜陶瓷基板性能测试3.1引言...............................................................................................................................283.2基本性能测试.......
7、........................................................................................................283.3基板可靠性实验...........................................................................................................303.4基板热阻测试....................................
8、...........................................................................313.5本章小结..........................
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