大功率某某散热用陶瓷金属基板的制备与性能-研究

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1、重庆大学硕士学位论文obtainabetterCucoatingunderannealing300℃andactivation25min.④ThethermalresistanceofAlandAlNceramicsubstratepackagingGaN-LEDlampwas10.61℃/Wand2.71℃/W,andtheinfrarytestingtemperaturewas77℃and63℃,respectively.⑤Comsolmultiphysisoffiniteelementmodelwasusedtosi

2、mulationthetemperatureandcurrentdensitydistributionofAlandAlNceramicsubstratepackagingGaN-LEDlamp,andtherelativeerrorstoexperimentalresultswas0.92%and0.60%.⑥Finiteelementsmethodsareusedtoinvestigatethermal-electricalcharacteristicsofgallium-nitride(GaN)light-emitt

3、ingdiodes(LED)withdifferenttransparentconductivelayers(TCLs)andelectrodesburieddepth,wheretransparentconductivelayersincludeindiumtinoxide(ITO),graphene(Gr)andthecombinationofthem(ITO/Gr).TheresultsindicatethatLEDwithTCLof100nmITOor4-layersGrhasagoodthermal-electr

4、icalperformancefromthepointofviewofthemaximumtemperatureandthecurrentdensitydeviationofmultiplequantumwell(MQW).ThecompoundTCLwith20nm-ITOand3-layersGrreachestoabetterthermal-electricalperformance.Theelectrodesburieddepthis0.51μm,thethermal-electricalperformanceof

5、theGaN-LEDcanbefurtherimproved.Keywords:electrolesscopperplating,adhesionforce,electricconductivity,thermalconductivity,finiteelementmodelIV目录目录中文摘要....................................................................................................................

6、............................I英文摘要.............................................................................................................................................III1绪论....................................................................................

7、...........................................................11.1引言................................................................................................................................................11.2LED散热问题简介..........................................

8、..............................................................................31.2.1LED基本机理.............................................................