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1、射频微波器件的电磁场和电路协同仿真罗辉hui.luo@ansys.comANSYS高频应用工程师1©2012ANSYS,Inc.November11,2014Release15.0February23,2009Inventory#002593Outlines•ANSYSSolutionBriefIntroductionANSYSHFSSIntroductionANSYSDesignerIntroductionANSYSCo-SimulationSolution•Example:16WayPowerDividerDesign•Example:Anten
2、naSystemCo-Simulation2©2012ANSYS,Inc.November11,2014Release15.0February23,2009Inventory#002593ANSYSHFSSHFSSisahigh-performancefull-waveelectromagnetic(EM)fieldsimulatorforarbitrary3Dvolumetricpassivedevicemodeling.Itintegratessimulation,visualization,solidmodeling,andautomationina
3、neasy-to-learnenvironmentwheresolutionstoyour3DEMproblemsarequicklyandaccuratelyobtained.HFSSemploystheFiniteElementMethod(FEM),adaptivemeshing,andbrilliantgraphicstogiveyouunparalleledperformanceandinsighttoallofyour3DEMproblems.AnsoftHFSScanbeusedtocalculateparameterssuchasS-Par
4、ameters,ResonantFrequency,andFields.Typicalusesinclude:•Antennas/MobileCommunications–Patches,Dipoles,Horns,ConformalCellPhoneAntennas,QuadrafilarHelix,SpecificAbsorptionRate(SAR),InfiniteArrays,RadarCrossSection(RCS),FrequencySelectiveSurfaces(FSS)•Waveguide–Filters,Resonators,Tr
5、ansitions,Couplers•Filters–CavityFilters,Microstrip,DielectricPackageModeling–BGA,QFP,Flip-Chip•EMC/EMI–ShieldEnclosures,Coupling,Near-orFar-FieldRadiation•PCBBoardModeling–Power/Groundplanes,MeshGridGrounds,Backplanes•Silicon/GaAs-SpiralInductors,Transformers•Connectors–Coax,SFP/
6、XFP,Backplane,Transitions3©2012ANSYS,Inc.November11,2014Release15.0February23,2009Inventory#002593ANSYSDesigner•Integratedschematic,layoutanddesignmanagementfront-end•Simulatescomplexanalog,RF,SIandmixed-signaldesigns•DynamicallylinksAnsysEMfieldsolvertoolswithCircuitandSystemsolv
7、ers•Enablesrapidanalysis,optimizationandtuningofcircuitsorsystems4©2012ANSYS,Inc.November11,2014Release15.0February23,2009Inventory#002593Designer-PlanarEM•2.5DFull-waveMoMTechnology–LayoutdrivenEMsimulations–MOMsolversforSpeed,MemoryandSize–Surfacemeshforsignallayersandgroundcuto
8、uts–Thinandthickmetalsolvers•Desi