欢迎来到天天文库
浏览记录
ID:10682331
大小:181.00 KB
页数:5页
时间:2018-07-07
《引线键合应用中的无偏倒技术_英文_》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、引线键合应用中的无偏倒技术HuiWangDaveDeGrappo(Kulicke&SoffaIndustries2101BlairMillRoadWillowGrovePennsylvania19090USA)摘要:无偏倒技术(NoSWEEP)是引线成型工艺过程中防止引线偏倒或偏斜的一种工艺技术。该工艺技术包含独特的材料、设备和工艺,提供了当前生产工艺便于实施的有效方法。关键词:引线键合;无偏倒技术;偏斜;应用中图分类号:TN305文献标识码:A文章编号:1004-4507(2003)05-0011-05NoSWEEPTechnologyforWirebondin
2、gApplicationsHuiWang&DaveDeGrappoKulicke&SoffaIndustries2101BlairMillRoadWillowGrovePennsylvania19090USAAbstractNoSWEEPisatechnologytopreventwiresweepandorswayduringmoldingprocess.Thistechnologyincludesuniquematerialequipmentandprocesstoprovidecost-effectivemethodwhichcanbeeasilyimple
3、mentedoncurrentproductionprocess.KenywordsWirebondingNoSWEEPSwayApplication1IntroductionToday'ssemiconductorindustrycontinuestodriveforlowcost/highperformancecomponents.Thechallengeistomaintainthecurrentpackagingtechnologycostswhileenhancingcomponentperformance.Continueddieshrinksandt
4、ighterwirebondingpitchallowsassemblerstoutilizecurrentpackagedesignswhilereducingfinishedpackageciststhroughdiedesign.Currentlywirebondpitchreaches40micronswith30μmindevelopmentandwirelengthscanbelongerthan300mils.Forthosefinepitchand/orlongwireapplicationitisverydifficultto收稿日期:2003-
5、07-28processwithtraditionalmoldingmaterialandprocessesduetowiresweep/shortreducingincreasedyieldlossatmold.Althoughthereareotherpotentialsolutionstothemoldsweepproblemtheyareeithertoocostlyornotmatureenoughforlargevolumeproduction.NoSWEEPisanewtechnologyspeciallydevelopedforpreventin
6、gwiresweepand/orwireswayduringthemoldingprocess.Thisuniquetechnologyprovidesamaterialequipmentandprocesssolution.NoSWEEPencapsulantisanovelone-componentsilicafilledliquidproductdesignedforencapsulationoffinepitchwirebondsforlongwirelengthsonsemiconductordevices.Thismaterialcanbedispen
7、sedandUVcuredbyusingauniquedesignedkitinstalleddirectlyonawirebondernlinewiththewirebondingprocesswithnoimpacttothewirebonderUPH.NoSWEEPcanalsobeprocessedonconventionaldispenseandUVcureequipment.Thematerialispostcuredduringtheregularmoldingprocess.TheNoSWEEPencapsulantpropertiesarecom
8、patib
此文档下载收益归作者所有