IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

ID:9901912

大小:3.67 MB

页数:114页

时间:2018-05-14

IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method_第1页
IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method_第2页
IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method_第3页
IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method_第4页
IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method_第5页
资源描述:

《IEC 60068-2-69-2017 Environmental testing –Part 2-69 Tests – Test Te Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库

1、IEC60068-2-69®Edition3.02017-03INTERNATIONALSTANDARDNORMEINTERNATIONALEEnvironmentaltesting–Part2-69:Tests–TestTe/Tc:Solderabilitytestingofelectroniccomponentsandprintedboardsbythewettingbalance(forcemeasurement)methodEssaisd'environnement–Partie2-69:Ess

2、ais–EssaiTe/Tc:Essaidebrasabilitédescomposantsélectroniquesetcartesimpriméesparlaméthodedelabalancedemouillage(mesuredelaforce))fr-en(30-7201:69-2-6068IECTHISPUBLICATIONISCOPYRIGHTPROTECTEDCopyright©2017IEC,Geneva,SwitzerlandAlrightsreserved.Unlessotherw

3、isespecified,nopartofthispublicationmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includingphotocopyingandmicrofilm,withoutpermissioninwritingfromeitherIECorIEC'smemberNationalCommiteeinthecountryoftherequester.Ifyouhaveanyquestio

4、nsaboutIECcopyrightorhaveanenquiryaboutobtainingadditionalrightstothispublication,pleasecontacttheaddressbeloworyourlocalIECmemberNationalCommiteeforfurtherinformation.Droitsdereproductionréservés.Saufindicationcontraire,aucunepartiedecetepublicationnepe

5、utêtrereproduiteniutiliséesousquelqueformequecesoitetparaucunprocédé,électroniqueoumécanique,ycomprislaphotocopieetlesmicrofilms,sansl'accordécritdel'IECouduComiténationaldel'IECdupaysdudemandeur.Sivousavezdesquestionssurlecopyrightdel'IECousivousdésirez

6、obtenirdesdroitssupplémentairessurcetepublication,utilisezlescoordonnéesci-aprèsoucontactezleComiténationaldel'IECdevotrepaysderésidence.IECCentralOficeTel.:+412291902113,ruedeVarembéFax:+41229190300CH-1211Geneva20info@iec.chSwitzerlandwww.iec.chAboutthe

7、IECTheInternationalElectrotechnicalCommission(IEC)istheleadingglobalorganizationthatpreparesandpublishesInternationalStandardsforallelectrical,electronicandrelatedtechnologies.AboutIECpublicationsThetechnicalcontentofIECpublicationsiskeptunderconstantrev

8、iewbytheIEC.Pleasemakesurethatyouhavethelatestedition,acorigendaoranamendmentmighthavebeenpublished.IECCatalogue-webstore.iec.ch/catalogueElectropedia-www.electropedia.orgThestand-aloneapplicationforconsultingtheentireThew

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。