单片机课程设计报告(万年历)

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1、目录一、摘要·········································································2二、设计任务.····································································4三、总体方案设计与论证···························································41、液晶显示模块·························

2、····································42、实时时间计算模块·························································53、实时环境温度采集模块·····················································54、报警模块······························································65、设置模块··············

3、················································6四、总体方案组成框图··························································7五、系统硬件设计·····························································81、LCD显示模块··························································82、实时

4、时间计算模块······················································123、实时环境温度检测模块·················································16第64页共64页4、报警模块·····························································215、设置模块····················································

5、·········22六、系统软件设计····························································23七、系统硬件电路设计························································24八、系统硬件PROTEUS仿真原理图············································25九、系统硬件仿真运行情况图··································

6、················261、显示欢迎界面·························································262、显示实时时间··························································263、显示当前温度··························································274、时间设置·································

7、·····························275、最高报警温度设置······················································286、闹钟时间设置··························································287、超温··································································298、闹钟时间到················

8、············································29附录一：实物图······························································30第64页共64页附录二：PCB图···············································