苹果5手机 拆机图.doc

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1、资深芯片分析及知识产权保护咨询公司TechInsights通过对AppleiPhone5的深度拆解并对芯片内部进行分析，在今天释放出iPhone5主要零部件清单。AppleA6CPU内部核心标识AppleA6-处理器ElpidaB8164B3PM-LowPowerDDR2SDRAM-Elpida内存MurataSWUA127223-AntennaSwitchTriquintTQM-1229-PowerAmplifierModuleAvagoAFEM-7814-3G/4GFamilyLTE/UMTS/CDMADual-BandPAD(PA+DuplexerModule)-B

2、and1andBand4SkyworksSKY77729-4-PowerAmplifierControl-LTEBand17SkyworksSKY77487-18-PowerAmplifierControl-LTEBand1SkyworksSKY70631-PowerAmplifierDuplexerModuleSkyworksSKY77352-15-PowerAmplifierControl-Quad-band,GSM/GPRSDialogSemiconductorD2013(338S1131)-PowerManagementICCirrusLogicCLIIS8881

3、(338S1117)-AudioCodec-音频芯片STMicroelectronicsL3G4200DH-3-AxisDigitalMEMSGyroscopeModule-3轴陀螺仪STMicroelectronicsLIS331DLH-3-AxisMEMSAccelerometer-3轴加速计BroadcomBCM4334(Murata339S0171)-Single-ChipDual-BandComboDeviceSupporting802.11n,Bluetooth4.0+HS&FMReceiver-蓝牙BroadcomBCM5976-TouchpadContro

4、llerQualcommMDM9615-MobileDataModemsupportingLTE(FDDandTDD),DC-HSPA+,EV-DORev-BandTD-SCDMAQualcommRTR8600-GSM/CDMA/W-CDMA/LTERxDTransceiver+GPSQualcommPM8018-PowerManagementIC-电源管理TexasInstruments27A333DI-TouchscreencontrollerSanDiskSDMALBB4-32GBmulti-chipmemorypackagew/controller-SanDisk

5、闪存RFMicroDevicesRF1102-SP9TAntennaSwitch-天线开关高通MDM9615diemarking高通RTR8600芯片DiephotoAppleA6DiePhoto