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ID:56976071
大小:1.74 MB
页数:35页
时间:2020-07-25
《各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test课件.ppt》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、Wettabilitytestingofcopperbasedsurfacefinishesforleadfreeassembly/各表面處理的無鉛焊接焊錫性測試InformationprovidebyAtotech/資料由Atotech提供2006.3.2Trainingprinciple/培訓原則Noadvertisement/拒絕做廣告Focusonexperimentalmethodologyandconclusions/注重于實驗方法和結論Withtheaimoflearningandself-improvement/本著學習和自我提升的思想Onthebasisofd
2、iscussionandcommunication/立足于交流與討論PTmanagerclaims/生技經理宣Afewnotes/几點說明Thisisagenuinepiracy/本報告純屬盜版Feelfreetoask/有問題盡管問Prepareformyquestions/請准備解答我的問題Correctanyexistingmistake/糾正所有存在的錯誤Theaccuracyofthedataisreserved/本人不負責數据的准确性Jeekclaims/袁進宣Content/內容Generalintroduction/簡介Reflowprofiles/回流焊溫度曲
3、線Wettabilitytesting&methods/潤濕性測試與方法Discussion/討論Conclusion/結論What’sdifferentinleadfreesoldering?/無鉛焊接到底不同在哪里?Peaktemperatureishigher/最高焊接溫度更高了Timeaboveliquidusislonger/焊料在熔化狀態下的時間更長了Soldercompositionisdifferent/焊料的成份有變化Whatdoesitmean?/無鉛焊接意味著什么?Highertemperature/longertimes/differentsoldera
4、lloy/更高的焊接溫度/更長的熔錫時間/焊料合金成份的變化Strongeroxidationofsolderpasteandsurfacefinish/焊膏和表面處理的氧化更嚴重ThicknessofIMCincreased/合金層厚度更厚Metallurgyofsolderjointsisdifferent/焊接點金屬特性的變化Nolongtermproductionexperience/沒有長期的量產經驗Reflowequipment/回流焊設備Reflowequipmentforinvestigations/用于研究的回流焊設備REHMNitro2100N2atmosp
5、herewithcontrolledO2concentration/氮氣保護,控制氧气含量5heatingzones/5個加熱段Convectionreflowsystem/對流傳熱回流焊系統Usedreflowprofileforsubsequentagingandsoldering/后續的老化實驗和焊接的溫度曲線Eutectictinlead/錫鉛合金Sn/Pb/錫鉛比63/37/Leadfree/無鉛焊料SnAgCu/錫銀銅比307Peak最高溫度210/46s秒>183oCPeak最高溫度260/60s秒>217oCAllprofilessamedurationofti
6、me各种溫度曲線所經歷的時間Copperbasedfinalfinishes,investigatedlayers研究的各种表面處理層Surfacefinish/表面處理Specification/規格Immersiontin/化學錫1.2um,incl.anti-whiskeradditive/1.2um厚,含防錫鬚添加劑Immersionsilver/化學銀0.2um,commerciallyavailablesilver/organic/0.2um厚,市面上的含有机保護膜的產品HASL/熱風整平(噴錫)SnCuNi,horizontallyprocessed/水平線OSP
7、/有机保護膜Leadfreecompatible/無鉛焊接型Wettabilitytesting/潤濕性測試Comparisonof/對比性測試項目Wettingbalance/潤濕平衡性測試Solderspread/錫料延伸性測試Mis-printtest/絲印錯位測試De-wetting/縮錫測試Varying/可變因素Solderflux/不同的助焊劑Solderalloys/eutectictin-leadvs.lead-free/不同的焊料—錫鉛焊料與無鉛焊料Solderingat
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