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时间:2020-04-30
《光刻技术:发展路径及未来趋势.pdf》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、第3O卷第1期影像科学与光化学Vo1.3ON0.12012年1月ScienceandPhotochemisJan.,2012Lithography:ItsPathofEvolutionandFutureTrendsYoshikazuYamaguchi,AkimasaSoyano,MotoyukiShima(Sem∞nd“ctorMaterialsLaboratory,FineElectronicResearchLaboratories,JSRCorporation,100Kazvajiri—cho,YokkaichiMie512
2、—8550,Japan)Abstract:Opticallithographyplaysanimportantrolewithinhighvolumemanufacturing(HVM)ofsemiconductordevices.Most“Stateoftheart’’FabshaveimplementedArFimmersiontechnologytoday.Doublepatterning,doubleexposure,andside-wa11imagetransfertechnologyallowfortheextens
3、ionofArFimmersioninto32nmhaK-pitch(HP)application.Inordertofabricatefinerpatterns,itisnecessarytOdevelopnewprocesses.EUV1ithographyisa1eadingnextgeneranonsolutionfor22nmHPandbeyond.Inaddition,alternativesolutionssuchasnano-imprintlithographyandmaskqesstechnologyareal
4、sobeingconsideredforadvancednodes,however,theyareonlyinthedevelopmentstageatthistimeandintheircurrentstaterepresenta1otofchallengesforHVM.Inthispaper,anoverviewO±lithographyisdescribedfromtheaspectof“Materials”.Additionally,futuretrendsinlithographywillbediscussed.Ke
5、ywords:lithography;nanodevices;resolutionenhancement;photoresistmaterialsArticleID:1674—0475(2012)01—0001—08CIA2number:TN305Documentcode:AIntroductionDemandsforhighperformancechipshavebeendrasticallyincreasedaccordingtothedevelopmentofsmartphones,tablet—PCsandSOon.Sc
6、alingisanongoingchallengetofabricateachipwithmulti—functionsinalimitedspaceforsemiconductormanufacturers.Inaccordancewiththedesignrules,everytwoyearscriticaldimensions(CD)haveshrunkinhalfc¨.Scalinghasbeenrealizedbymakingaphotolithographypatternfinerandfinerbyimplemen
7、tingalightsourcethathasashorterwavelengthforlithography.Inthedevelopmentofphotoresistsforeachwavelength,suchasg-line,i—line,KrFandArF,itisnecessarytoselectsuitableresinplatformsinordertoobtaintransmittanceofthewavelengthbeingused.Sincesub一60nmHP,ArFimmersiontechnolog
8、yhasbeenintroducedanddeviceswith45nmHParemanufacturedinmass—DroductionlinebysingleexposureofArFimmersiontechniquestoday.For32nmHPan
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