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1、TechnologyRoadmapforMicroelectromechanicalSystems(MEMS)1.IntroductionMicroElectro-MechanicalSystems,morecommonlyknownbytheirabbreviation‘MEMS,’aremicron-sizeddevicestypicallyfabricatedbysiliconfoundry-likeprocess.However,MEMSareknownbydifferentnames:MEMSintheUnitedStates;MicrosystemsTech
2、nologies(MST)inEurope,andMicromachinesinJapan.Nevertheless,MEMSisnotasingletechnologybutagenericnameforadiversefamilyof‘enabling’microtechnologies.Importantly,MEMSisrightontrackasadisruptivetechnology.Byandlarge,MEMShavemovingpartsthatenablethemtosenseormanipulatethephysicalenvironment.T
3、hesechip-leveldevicesarecreatedusingmicromachiningprocessingstepsderivedfrombasicsiliconmanufacturingtechniquesdevelopedbythemicroelectronicsindustry.Inreality,MEMShavebeenaroundformanyyearsnow.Justlikemanyotherprocesses,mostmicromachiningemployedinMEMSfabricationisadirectoffshootfromthe
4、ICindustry.MEMSistheintegrationofmechanicalelements,sensors,actuatorsandelectronicsonacommonsiliconsubstratethroughmicrofabricationtechnology.Thesesystemscansense,controlandactivatemechanicalprocessesonthemicroscale,andfunctionindividuallyorinarraystogenerateeffectsonthemacroscale.Themic
5、rofabricationtechnologyenablesfabricationoflargearraysofdeviceswhichindividuallyperformsimpletasksbutincombinationcanaccomplishcomplicatedfunctions.MEMSarenotaboutanyoneapplicationordevicenoraretheydefinedbyasinglefabricationprocessorlimitedtoafewmaterials.Theyareafabricationapproachthat
6、conveystheadvantagesofminiaturization,multiplecomponentsandmicroelectronicstothedesignandconstructionofintegratedelectromechanicalsystems.Thistechnologyhasexpandedtheconventionaltwo-dimensionaldesignofchips;itisnowpossibletobuildthree-dimensionalstructuresintonumeroussubstratessuchassili
7、conwafer.Thus,enablingtheentiresystemtobeembeddedontoasinglechip.12.ApplicationsofMEMSInitiallyMEMSaremostpopularintheautomotiveindustry.However,MEMStechnologycapabilitiesarenotconfinedtotheautomotiveindustrysolelybutmanyotherapplicationsnamelyinindustrial,military,biotec