集成型功率模块的开发.pdf

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1、IPEMDesignandDevelopmentT.M.Jahns,UW-MadisonFredC.Lee,VirginiaTechGiriVenkataramanan,UW-MadisonMarch2000Outline•Introduction•DiscussionofBasicIPEMFeaturesandResponsibilities•ReviewofState-of-the-ArtIPEMTechnology•KeyIPEMChallenges•FutureIPEMVision•DiscussionofCPESIPEMTechnologyProje

2、cts–FirstGeneration(w/FCLee)–SecondGeneration•IPEMInterconnectionTechnology(G.Venkataramanan)GrundfosSubmersiblePump•CombinesPMmotoranddriveelectronicsinnarrowdiametershaft•HybridcircuitinverterimplementationSource:GrundfosApplicationNoteGrundfosPumpDriveConstructionSource:Jacobsen&

3、Hopkins,APEC2000RelianceIndustrial-GradeIntegratedMotor/DriveSource:RelianceSalesBrochure•Driveelectronicsmountedinseparatemoduleboltedtomotor•Availableinlow-horsepowerratingsRockwell-AutomationMotor/DriveIntegration•DriveelectronicsintegratedintomotorhousingextensionSource:G.Skibin

4、ski,R-AIPEMChallenges•Cost•Reliability•Thermal•EMCCost•Inherentconflictbetweenhigh-volumestandardizationandtrendstowardsgreatercustomizationwithcomplexity–ImportanceofdistinguishingbetweenstandardmodulesandstandardIPEMprocess•Impactofyieldoncost–Complexitytendstobetheenemyofhighyiel

5、d•Sourcesofsolutions–Mature,high-volumeprocess(es)–Automation–Submodulepackagingandtesting–Lowercostcomponents–PackagingcostsavingsfromhigherintegrationlevelsReliability•Negativeimpactofhighpartscountandcomplexityonreliability•Criticalimportanceofinterconnectiontechnologyonreliabili

6、ty–Howdoweimproveonwire-bondreliability?•Increasinglynegativeimpactofsingle-componentfailuresoncostaslevelofintegrationincreases•Sourcesofsolutions–BettermaterialsforCTEmatching,fatigueres.,etc.–Improvedinterconnectiontechnologies–Componentderating–EnhancedthermalmanagementThermal•I

7、mportanceincreasesaspowerdensityincreases•Closelylinkedtoachievementofhighreliability•Significanceofthermalcyclinginadditiontotemperaturealone•Solutionapproaches–Higherefficiency–Improvedcooling–Higher-temperatureelectronicsApproachestoThermalSolutions•Higherefficiency*Newpowerdevic

8、es*Improvedpassivec