制造工程简要训练.ppt

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1、PCBA生產注意事項題綱(Chapter)頁次(Page)第1章IC元件外形及重要尺寸規格3~10第2章IC包裝及IC儲存管制11~16第3章SMT組裝及PCBA測試要求17~40第5章BGARework注意事項45~52第6章製程ESD/EOS防護技術53~76第7章IC故障分析(FailureAnalysis)77~80第4章SMT作業不良實例探討41~44第8章RMA退貨處理及更換良品之注意事項81~87Page2of87第1章IC元件外形及重要尺寸規格1-1.IC元件外形簡介(ICDevic

2、esIntroduction):ThroughHolePackageSurfaceMountedPackageKBGA(BallGridArray)FlipChipL1-2.208PQFP重要尺寸規格介紹(MechanicalSpecifications)：BentLeadSpec.VT82C586BYYWWRRTAIWANLLLLLLLLLCMY=DateCodeYearW=DateCodeWeekR=ChipRevisionL=LotCodePage5of87TheImportantSpecifi

3、cationsforQFP:1.LeadCo-planarity:USL:4.0mils.2.LeadSpan:USL:6.5mils.3.BentLead:USL:+3mils,LSL:-3mils.4.QFPPackagewarpage:USL:4mils.5.LQFPPackagewarpage:USL:3mils.(1)USL:UpperSpec.Limit.(2)LSL:LowerSpec.Limit.(3)1mil=0.0254mm.LeadCo-planaritySpec.P

4、age6of871-3.476PBGA重要尺寸規格介紹(MechanicalSpecifications):SolderBallDiameterTrueballpositionerrorY=DateCodeYearW=DateCodeWeekR=ChipRevisionL=LotCodePage7of87TheImportantSpecificationsforBGA:1.SolderBallCo-planarity:USL=5.5mils2.Trueballpositionerror:USL=+6.

5、0mils,LSL=-6.0mils3.Balldiameter:USL=35mils,LSL=24mils4.Packagewarpage:USL=3.5mils5.SolderBallHeight:USL=28mils,LSL=19mils.(1)USL:UpperSpec.Limit.(2)LSL:LowerSpec.Limit.(3)1mil=0.0254mm.SolderBallCo-planaritySolderBallHeightPage8of871-4.TheStructu

6、reofSolderSpheretoSubstrate:BT-RESINPAD(Cu)Plating(Ni)Plating(Au)SolderBall(Sn/Pb)SolderMaskSolderMaskOriginalBT-RESINPAD(Cu)IMClayer(IntermetalicCompound,Au/Ni/Sn/Pb)SolderBall(Sn/Pb)SolderMaskSolderMaskAfterReflowPage9of871-5.TransformationofBGASolder

7、SphereinReflow:Page10of870.030’’(0.76mm)0.016’’(0.41mm)**BGASubstratePCB/PWBSolderSphereCollapseCoplanarityissuearevirtuallyeliminatedwiththefinalcollapse**Thefinalheightwillvarywithpadsizeandsolderpastedeposition.SolderBallSolderBallscollapseduringrefl

8、owCanbereflowedwithjustfluxWillselfcenterduringreflowprocessNocleanfluxrecommendedPBGASolderBalls(0.60mm)第2章IC包裝及IC儲存管制2-1.IC真空密封包裝儲存期限：(注意密封日期)★12monthsat<40ºCand<90%RelativeHumidity(RH).2-2.IC包裝拆封後，SMT組裝時限：★檢查溫度指示卡：顯示值應小於20%(藍色