MEMS(数字)麦克风基本知识.ppt

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1、MEMSMicrophone产品简介1.体积小.2.便于SMT安装.3.耐高温,稳定性好.4.灵活的设计应用.5.兼容数字化发展.6.自动化程度高.7.适合大批量生产.MEMSMicrophoneMEMSMicrophonePresentationMEMSMicrophone产品简介MEMS麦克风是由MEMS微电容传感器、微集成转换电路(放大器)、声腔及RF抗噪电路组成。MEMS微电容极头部分包含接收声音的硅振膜和硅背极,硅振膜可直接将接收到的音频信号经MEMS微电容传感器传输给微集成电路,微集成电路可将高阻

2、的音频电信号转换并放大成低阻的音频电信号,同时经RF抗噪电路滤波,输出与手机前置电路相匹配的电信号.完成“声--电”转换.MEMSMicrophone工作原理MEMSMicrophone产品简介VoutSiliconBackPlateSilicondiaphragmGNDRFFilterMEMSMicrophoneModuleStructureVsupplyMEMSAcousticSensorASICMEMSMicrophone产品简介MEMSWaferMEMSDieMEMSMicrophoneWafer&M

3、EMSDieMEMSMicrophone产品简介MEMSMicrophoneProfileAcousticportholeLWH4213PIN#FUNCTION1.OUTPUT,2.NOCONNECTION3.GROUND,4.POWERMEMSMicrophone产品简介序号名称1Cover2Housing3Wirebonding4PCBoard5Capacitor10pF6Capacitor33pF7ASIC8MEMSDieMEMSMicrophoneStructure12367854MEMSMicrop

4、hone产品简介SpecificationMEMSMicrophoneFrequencyrange100-10,000HzSensitivity(0dB=1V/Pa@1kHz)-42dB+/-3dBOutputimpedance<100ΩmaxSignaltonoiseratio(SNR)>58dBRF-filteringcapacitance10pF,33pF,bothornoneChangeinsensitivity(电压特性)<1dBacrossvoltagerangeStandardoperating

5、temperature-40℃to+100℃Currentconsumption0.25mASupplyvoltageratings1.5Vto3.6VPerformanceComparisonMEMSMicrophone产品简介RecommendedInterfaceCircuitAACMEMSMicrophoneTerm3.Term2.Term4Term1-+VrefExternalGain=-R1/R2(Setbycustomer)+R2R1MEMSMicrophone产品简介SolderReflowP

6、rofileMaximumsolderprofile:DonotexceedprofilelistedinthistableStageTemperatureProfileTime(Maximum)Pro-head170~180℃120sec.SolderMeltAbove230℃100sec.Peak260℃Maximum30sec.IncomingInspectionWaferSawingWaferExpandSMT/glueingPackaging/CuttingTesting/Marking/Tapin

7、gShippingInspectionPackingWaferFabricationPackagingWaferFoundryPickupandplaceMEMSWireBondingReliabilityTestWaferTestingWaferInspectionProductionProcessMEMSMicrophoneMEMSMicrophone产品简介CellularPhone(CDMA,GSM,PCS),CamcorderPhone,MP3Phone,PDAPhoneetc.C

8、amcorder,DigitalCameraetc.EarPhoneMICforHeadsets,MP3,Bluetooth,etc.NotebookComputer,Desk-TopComputerVideoDoorPhoneetc.CordlessPhoneMEMSWaferFab.MEMSPackagingApplicationofProductMEMSMicr