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ID:50358900
大小:1.70 MB
页数:13页
时间:2020-03-15
《欧司朗-高功率LED Reliability.pdf》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、ReliabilityoftheDRAGONProductFamilyApplicationNoteIntroductionThisapplicationnoteprovidesanoverviewoftheperformanceoftheDRAGONproductfamily(inthiscase,LEDswithoutplasticlenses)aswellasasummaryofthemostimportantcustomer-relevantLEDdatawithrespecttoitseffectonLEDlifetime.Ingeneral,itshould
2、benotedthatinspiteofthehighreliabilityofLEDs,ahightotalorsystemreliabilitycanonlybeachievedifallfactorsandparametersaretakenintoconsideration(seeApplicationNotemeansoflead-freeIRreflowsoldering"ReliabilityandLifetimeofLEDs").techniques.ApossibleinfluenceonthereliabilityoftheAswithallothe
3、rLEDsfromOSRAMOptoLEDbytheuserisessentiallyspecifiedbySemiconductors,theDRAGONproductlinethechosenoperatingconditions,byalsofulfillscurrentRoHSguidelinesandconsiderationoftheprocessingdetails,andcontainsnoleadorotherhazardousforhighpowerLEDssuchastheDRAGONsubstances.productfamily,forexam
4、ple,bytheprovisionofadequatethermalmanagement.ConstructionandagingDRAGONproductfamilymechanismsofDRAGONLEDsTheDRAGONproductfamilywasprimarilyTheconstructionoftheDRAGONproductdevelopedforapplicationswhichrequirefamilyisbasedonathermally-optimizedmaximumlightcombinedwithlowspacepackagedesi
5、gn,consistingofaprefabri-requirementsandthehighestdemandsoncatedplasticpackagewithanintegratedlifetime.heatsinkandconnectioncontactsDuetotheirperformanceanddesign,(Figure1).DRAGONLEDsaresuitablefordiverseareasoflightingandilluminationtechnology,Anadvantageofthisdesignisthatitpermitsrangi
6、ngfromgenerallightingtoautomotivemutualexchangeabilitywithintheproductapplicationsandthereplacementoffamily,thusincreasingcustomerflexibilityminiatureincandescentlamps.duetoidenticalsolderpadlayouts.Designedforhigh-volumeproduction,theyAprimaryfactorwhichinfluencesthelifetimecanbeprocess
7、edwithallestablishedofanLEDisthetemperatureofthelight-populatingtechniquesandmountedbyemittinglayerorjunctiontemperature(Tj)withwhichtheLEDisdrivenintheapplication.May,2011Page1of13Figure1:DRAGONbasicpackage–thermallyoptimizedWithalowerjunctiontemperature,theexpectedlifet
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