PCB 工艺流程.ppt

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1、BROADTECHOLOGYINC.BROADTECHOLOGYINC.印制电路板（PCB）制作流程主讲：杨兴全(高工)深圳市博敏电子有限公司一、多层板内层制作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.显影DEVELOPING曝光EXPOSURE压膜LAMINATION去膜STRIPPING蚀刻铜ETCHING黑化处理BLACKOXIDE烘烤BAKINGLAY-UP预叠及叠板后处理POSTTREATMENT压合LAMINATION内层图形转移INNERLAYERIMAGE预叠及叠板LAY-UP蚀刻I/LETCH

2、ING钻孔DRILLING压合LAMINATION内层制作流程INNERLAYERPRODUCTMLPCBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE二、多层板外层制作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.孔金属化P.T.H.钻孔DRILLING外层图形转移OUTERLAYERIMAGE图形电镀铜/锡PATTERNPLATING检查INSPECTION前处理PRELIMINARYTREATMENT图形电镀铜PATTERNPLATING蚀刻ETCHING全板镀铜PAN

3、ELPLATING外层制作OUTER-LAYERO/LETCHING蚀刻TENTINGPROCESSDESMER除胶渣E-LESSCU孔金属化前处理PRELIMINARYTREATMENT退锡T/LSTRIPPING去膜STRIPPING压干膜LAMINATION镀锡T/LPLATING曝光EXPOSURE三、外形制作和成品检查流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.阻焊印制LIQUIDS/M外观检查VISUALINSPECTION成形FINALSHAPING检查INSPECTION测试ELECTRICALT

4、EST出货检查OQC成品PACKING&SHIPPING印制阻焊油S/MCOATING前处理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥PRE-CURE热风整平HOTAIRLEVELINGOSP表面防氧化处理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING镀金手指化学镍/金E-lessNi/AuForO.S.P.字符印制SCREENLEGEND选择性镀镍/金SELECTIVEGOLDBROADTECHOLOGYINC.BROADTECHOLOGY

5、INC.附件：典型多层板制作流程1.内层开料2.内层线路压膜BROADTECHOLOGYINC.BROADTECHOLOGYINC.4.内层线路显影3.内层线路曝光BROADTECHOLOGYINC.BROADTECHOLOGYINC.5.内层线路蚀刻6.内层线路去膜BROADTECHOLOGYINC.BROADTECHOLOGYINC.7.叠板8.层压LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6BROADTECHOLOGYINC.BROADTECHOLOGYINC.9.钻孔10.孔金属化BROADTECHOLOGY

6、INC.BROADTECHOLOGYINC.11.外层线路压膜12.外层线路曝光BROADTECHOLOGYINC.BROADTECHOLOGYINC.13.外层线路显影14.图形电镀铜/锡BROADTECHOLOGYINC.BROADTECHOLOGYINC.15.外层去膜16.外层蚀刻铜BROADTECHOLOGYINC.BROADTECHOLOGYINC.17.退锡18.阻焊印制BROADTECHOLOGYINC.BROADTECHOLOGYINC.19.浸金或热风整平BROADTECHOLOGYINC.BROADTECHOLOGYINC

7、.四、PCB各制程物料消耗COPPERFOILEpoxyGlass1、下料裁板物料消耗：2、拼板废弃的覆铜板1、成品加工板料消耗BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist2、内层图形转移物料消耗：1、干膜或湿膜（光致油墨）BROADTECHOLOGYINC.BROADTECHOLOGYINC.Artwork(底片)Artwork(底片)光源3、曝光物料消耗：PhotoResist曝光后1、菲林2、UV灯管BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResi

8、st4、内层显影物料消耗：1、显影液（碳酸钾等）BROADTECHOLOGYINC.BROADTECHOLOGYINC.PhotoResist5、内层