NOKIA全球制造执行标准.doc

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1、4.14.24.34.44.5ReflowprofiledefinitionforPb-freeprocessGeneralPb-freereflowsolderingprofilespecificationBasicprofilespecificationforstandardcalibrationboardinPb-freeprocessStart-upsettingsforPb-freeprocessReflowprofilemeasurementonproductPWBs1313131414151515161718181920212224242627CONTENTSSHIPPING,S

2、TORAGEandPRODUCTIONENVIRONMENT21.1Generalshippingandstorageconditions21.2Storageandhandlingconditionsforsolderpaste31.3Storageandhandlingconditionsforprintedwiringboards[PWBs]31.4Storageconditionsforunderfillepoxymaterials41.5Shelflifetimefordifferentcomponentcategories51.5.1Expiredmaterialhandling5

3、1.5.2Moisturesensitivitylevels51.6Drying(baking)moisturesensitivedevices61・6・1Drying(baking)restrictions61.7DRYSTORAGECONDITIONS71.8PASTESPECIFICATIONS7・STENCILPRINTINGPROCESSSPECIFICATIONS81.5.Squeegee81.5.Stencil81.5.Supporttables91.5.Printingprocessparameters(stencilprinting)101.5.Printresultvali

4、dation11・AUTOMATEDOPTICALINSPECTION,AOI121.5.Locationofthemachineintheproductionline121.5.Utilizationofinspectionresults121.5.Componentandpastealarmlimits12・PLACEMENTPROCESSSPECIFICATIONS13NozzlesFeedersNC・ProgramsPartData/VisionprocessingPlacementprocessmanagementdatacompatibilitytable・Reflowsolder

5、ingprofilemeasurement1.5.Profilemeasurementequipment1.5.Reflowprofilemeasurementmethod・Standard,leadcontainingsolderingprocess••…1.Recommendedreflowovensettings・Leadfreesolderingprocess7.17.27.37.47.5・UnderfiLIprocess1.5.General1.5.DispensingpatternforCSPcomponents・MANUALSOLDERINGPROCESSANDWORKMANSH

6、IPCRITERIA・Specificationsforvisualinspection;errorcriteria,faultsclassificationandtrainingmaterial.27・RelatedDocuments27SHIPPING,STORAGEANDPRODUCTIONENVIRONMENTNokiaRealEstate&Servicesorganizationisresponsibleofenvironmentalconditionsinmaterialstorageandfactoryfloor.Moredetailedspecificationcanbefou

7、ndfromtheirIntranetpages.6.1.1GeneralshippingandstorageconditionsExpectedshippingconditions(componentsandmaterials)RelativehumidityRH15%-70%Temperature-5°C...+40°CGeneralNMPStorageconditionsExternalen