pcb专业英语.ppt

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1、*ProcessModule說明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料發料(Panel)(ShearmaterialtoSize)B.鑽孔(Drilling)b-1內鑽(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射鑽孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)C.乾

2、膜製程(PhotoProcess(D/F))c-1前處理(Pretreatment)c-2壓膜(DryFilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(ChemicalMilling)c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing)c-11去膜(Stripping)D.

3、壓合Laminationd-1黑化(BlackOxideTreatment)d-2微蝕(Microetching)Developing,Etching&Stripping(DES)1d-3鉚釘組合(eyelet)d-4疊板(Layup)d-5壓合(Lamination)d-6後處理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8銑靶(spotface)d-9去溢膠(resinflushremoval)E.減銅(CopperReduction)e-1薄化銅(Cop

4、perReduction)F.電鍍(HorizontalElectrolyticPlating)f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂帶研磨(BeltSanding)f-6剝錫鉛(Tin-LeadStripping)f-7微切片(

5、Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2預烤(Precure)g-3表面刷磨(Scrub)g-4後烘烤(Postcure)H.防焊(綠漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3靜電噴塗(SprayCoating)h-4前處理(Pretreatment)h-5預烤(Precure)h-6曝光(Exposure)h-7顯影(Develop)h-8後烘烤(Pos

6、tcure)2h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11噴砂(Pumice)(WetBlasting)h-12印可剝離防焊(PeelableSolderMask)I.鍍金Goldplatingi-1金手指鍍鎳金(GoldFinger)i-2電鍍軟金(SoftNi/AuPlating)i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au)J.噴錫(HotAirSolderLeveling)j-1水平噴錫(HorizontalHo

7、tAirSolderLeveling)j-2垂直噴錫(VerticalHotAirSolderLeveling)j-3超級焊錫(SuperSolder)j-4.印焊錫突點(SolderBump)K.成型(Profile)(Form)k-1撈型(N/CRouting)(Milling)k-2模具沖(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜邊(BevelingofG/F)L.短斷路測試(ElectricalTesti

8、ng)(Continuity&InsulationTesting)l-1AOI光學檢查(AOIInspection)l-2VRS目檢(Verified&Repaired)l-3汎用型治具測試(UniversalTester)l-4專用治具測試(DedicatedTester)l-5飛針測試(FlyingProbe)M.終檢(FinalVisualInspection)m-1壓板翹(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包裝及