SMT表面贴装制程.ppt

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1、SMTManufactureprocessWritebyMOEBG/SMTManufactureEngineer–YxlanSDcardsocketSOPBGAQFNConnecterCrystalDSC-MainboardMaincomponent--BGAchipsetDSC-FPCboardOpticalcomponent--CCDSMTIntroductionAutomaticSMTline:71linesLocation:Cbuild-Floor2~42Dbuild-Floor3,42Ebuild-Floor2,3,4Linechang

2、e：30minsProductionEfficiency：99.5%Throughrate:88%DefectPPM:50PPMLostrate:0.4%PCBAaverageoutput:400K/monthControlbyKPISMTprocessPCBAFlowChartPCBPartsPrinterMountReflowSMTS.M.T:SurfaceMountTechnologyWhatisSMT:GoodPrint,andMountGood!!DIPSONYSIP-950SONYSIP-300SONYSVP-2000TypeSten

3、cilsize(mm)PrintdirectionWipePCBsize(mm)PCBThickness(mm)Printprecision(μm)SVP-2000650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50~(W)250*(D)3300.3~1.6±25SIP-950650*550*30X-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)70~(W)460*(D)3600.3~2.5±12SIP-300650*550*30Y-dir.Automatic(We

4、t,Dry&Vacuum)(W)50*(D)50~(W)460*(D)5100.4~3.0±20SMTEquipment–Printer(SONY)Solderpastevendor(Lead-freetype)PhotoSuppliersSenjuSenjuTypeM705-GRN360-K2-VL23-BLT5-T7FPowderalloySn96.5/Ag3.0/Cu0.5Sn42/Ag1.0/Bi57Meltpoint217℃138~204℃Powdersize25-36µm25-36µmFluxcontent10.5-12.5%10.0

5、%Viscosity(pa.s)200200StencildesignruleTypePrecision(mm)Speed(sec)ComponentsizeComponentheight(mm)MinPitch(mm)AnglePCBsize(mm)PCBheight(mm)E-1000/11000.060.17Chip0402-□12m㎡1~60.30--360º50*50-460*3600.5-2.6F-1300.060.139Chip0201-□12m㎡1~60.30--360º50*50-460*3600.5-2.6SMT-Mounte

6、r(SONY)SMT實裝設備中高速機(SONY)SMT實裝設備汎用機(SONY)TypePrecision(mm)Speed(sec)ComponentsizeComponentheight(mm)MinPitch(mm)AnglePCBsize(mm)PCBheight(mm)E-2000/21000.04Moved:0.6Fixed:1.4Chip2012-□32m㎡<250.30--360º50*50-460*3600.5-2.6F-2090.04Moved:0.49Fixed:1.4Chip2012-□32m㎡<250.30--36

7、0º50*50-460*3600.5-2.6SMT-Mounter(SONY)MounterfunctionX-YDATACAM350editGerberfileCombinationX-YDataandGerberfilebyCPSNozzleTypenumberAF06021(E&F)AF06042(E&F)AF10071(E&F)AF12082(E&F)AF25200(E&F)Outsidesize0.6mm0.6mm1.0mm1.4mm2.5mmInsidesize0.2mm0.4mm0.7mm1.0mm2.0mmComponent010

8、05,0201RLCchip0402RLCchip0603RLCchip0805RLCchip1208RLCchipTypenumber