键合丝调研报告.pdf

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1、20072007版微电子封装键合丝行业调研报告2007版微电子封装键合丝行业调研报告目目目录录录录1.微电子封装技术与产业状况.................................................................................11.1微电子封装及其功能.................................................................................11.2IC封装产品与技

2、术发展...............................................................................11.2.1从IC封装产品发展顺序看封装的技术进步....................................21.2.2当前主流的封装产品与技术.............................................................61.2.3IC封装产品品种的发展趋势.........

3、..................................................111.3世界IC封装产业状况.................................................................................111.3.1世界IC封装产业总体现状..............................................................111.3.2世界主要IC封装测试厂商....

4、.........................................................141.3.3世界IC产业发展趋势.....................................................................151.4国内IC封装产业状况................................................................................162.全球微电子封装材

5、料产业状况...........................................................................202.1世界IC封装材料整体产业状况................................................................202.2IC封装材料整体产业发展趋势.................................................................233

6、.引线键合技术.......................................................................................................233．1热压键合.....................................................................................................243．2超声键合法....................

7、............................................................................253．3热超声键合................................................................................................264.不同键合丝生产技术工艺及对比分析................................................

8、...............284.1键合金丝......................................................................................................2914.2键合铝丝......................................................................................................334.3键合铜丝...