封装制造流程介绍.pdf

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1、封裝製造流程2006-08-18Assemblyprocessflow課程大綱：1.1.1.介紹傳統和1.介紹傳統和BGABGA先進產品封裝流程BGA先進產品封裝流程2.2.2.晶圓切割2.晶圓切割,,,黏晶,黏晶,,,焊線到,焊線到ICICIC封裝完成各製程介紹IC封裝完成各製程介紹AddingValuetoMemory封裝製造流程2006-08-181.IC1.IC是什麼1.IC是什麼???2.IC2.IC元件的演進2.IC元件的演進3.3.3.半導體產品應用3.半導體產品應用4.IC4.IC封裝的4.IC封裝的功能與目的5.IC5.IC封裝製造流程5.IC封裝製造流程AddingVa

2、luetoMemory封裝製造流程1.IC1.IC是什麼1.IC是什麼???I.C.中文譯名:積體電路英文譯名:IntegratedCircuit-Fromnormal0.13umand0.11umto90nmand65nm力晶,茂德,華亞科,聯電和台積電0.13um台積電和聯電90nm台積電和聯電65nm-Wafersizefrom4、5、6、8to12inchevenfuture16inchAddingValuetoMemory封裝製造流程不同外形的ICICIC元件IC元件AddingValuetoMemory封裝製造流程PackagenamingrulePDIP:PlasticDua

3、lInlinePackageSOP:SmallOutlinePackageSSOP:ShrinkSmallOutlinePackageQFP:QuadFlatPackage(LQFPorTQFP)SOJ:SmallOutlineJ-leadPLCC:PlasticLeadChipCarrierBGA:BallGridArrayFBGA:FinePitchBallGridArrayTrenchBGA:TrenchBallGridArrayRemark:TSOP:ThinSmallOutlinePackageTSSOP:ThinShrinkSmallOutlinePackageAddingVa

4、luetoMemory封裝製造流程AddingValuetoMemory封裝製造流程1.IC1.IC是什麼1.IC是什麼???2.IC2.IC元件的演進2.IC元件的演進3.3.3.半導體產品應用3.半導體產品應用4.IC4.IC封裝的4.IC封裝的功能與目的5.IC5.IC封裝製造流程5.IC封裝製造流程AddingValuetoMemory封裝製造流程2.IC2.IC元件的演進2.IC元件的演進TSOPSOPSSOPPDIPQFPPLCCPBGAVF/TF/LF-BGATQFPLQFP.TrenchBGAforDDRI/II/IIIAddingValuetoMemory封裝製造流程技術

5、發展趨勢
晶片尺寸(ChipScale)封裝的樣式AuWireOverMoldedChipLFBGA(TotalheightMax.1.7mm)ViaLaminateSolderBallCuTracessubstrateAuWireOverMoldedTFBGA(TotalheightMax.1.2mm)LaminateCuTracesSolderBallsubstrateRemark:LFBGA,TFBGAandVF-BGAtotalheightdefinedbyJEDEC-STDAddingValuetoMemory封裝製造流程CodeDescriptionOverallheigh

6、t(“A”)NoneStandardProfileA>1.70mmLLowProfile1.20

7、etoMemory封裝製造流程MCP(Multi-ChipPackage)BumpBondElastomerGoldWireDie2CompoundSubstrateDie1SolderBallAddingValuetoMemory封裝製造流程SolderingBumpSolderFlipChipPackageICSubstrateSolderingBallAddingValuetoMemory封裝製造流程1.IC1