整线工艺流程图.pdf

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1、基片上料TCO（LPCVD设备，沉积透明导电前电极）2台LaserA（Ultraviolet）GCH(高质量清洗)LaserB（Green）绿色激光（3台）FrontGlassLoading紫外激光（2台）GCI(来料清洗)卸载缓冲互锁室UnloadLock预清洗（去离子水）制程模块4冷却并过渡到常压干燥回工艺平台并由操回工艺平台并由操回工艺平台并由操Drying控器传回交换装置Pre-CleaningProcessModule4控器传回交换装置控器传回交换装置(DIWater)沉积¼TCO前电极薄膜BackToProcessBackToProcessBackToProcessTablean

2、dTransferTableandTransfer基片升降台TableandTransferToGEUViaHandlerToGEUViaHandlerLift1ToGEUViaHandler毛刷清洗（清洗剂）最终清洗Brushing(WithDetergent)制程模块3FinalCleaningProcessModule3沉积¼TCO前电极薄膜第一道激光划刻第三道激光划刻第二道激光划刻LaserPattern1LaserPattern3最终清洗LaserPattern2(WithIsolationLine)(WithIsolationLine)FinalCleaning泡沫喷射制程模块2

3、BubbleJetProcessModule2沉积¼TCO前电极薄膜CCD定位并标记CCD定位（读标记）CCD定位（读标记）干燥CCDPositionandCCDPosition(ReadCCDPosition(ReadDrying·回片通道LaserMarkingMarking)Marking)ReturnTrack毛刷清洗制程模块1将基片回传至Lift2（清洗剂）Brushing(WithProcessModule1沉积¼TCO前电极薄膜操控器接收并固定Detergent)操控器接收并固定操控器接收并固定激光打码（二维码+序列号）HandlerReceivingHandlerReceiv

4、ingHandlerReceivingLaserMarking（Barcode+S/N）andFixingGlassandFixingGlassandFixingGlass加载缓冲互锁室预清洗（去离子水）LoadLockPre-Cleaning预热抽真空玻璃交换装置(DIWater)玻璃交换装置玻璃交换装置自动光学检视（基片缺陷）GlassExchangeUnitGlassExchangeUnitGlassExchangeUnitAutomaticOpticalInspection逆时针旋转90度逆时针旋转90度逆时针旋转90度基片升降台2Lift2基片传送器基片传送器基片传送器基片传送器基

5、片传送器ProloaderProloaderProloaderProloaderProloader基片传送器Proloader基片基片基片基片基片基片基片基片基片Substrate基片基片卡匣Cassette卡匣Cassette卡匣Cassette卡匣卡匣自动化传输线卡匣CassetteLIA(LineAutomation)卡匣Cassette基片基片基片基片基片激光清边基片传送器基片传送器大气机械手EdgeIsolationLaserProloaderProloaderAtmosphereRobot传送基片于LIA和KAI之间涂导电胶基片升降台2贴绝缘胶带ConductiveGlueLif

6、t2IsolationTapeApplyingDispensingmets缓冲互锁模块y加载缓冲互锁室SLoadLockModulegLoadLock贴固定胶带长导电带贴合int加载和卸载基片c预热抽真空FixationTapeLongContactingRibbonatnoCotuA制程模块1交导电带贴合连接点焊接线ProcessModule1CrossContactingWelding引·回片通道沉积¼TCO背电极薄膜Ribbon动制程模块3传输模块制程模块1ReturnTrack自ProcessModule3TransferModuleProcessModule1将基片回传至Lift2

7、沉积微晶硅薄膜传输基片于各模块沉积非晶硅薄膜背板上料制程模块2uc-Si批次B之间a-SiBackGlassLoadingProcessModule2边缘密封胶涂布沉积¼TCO背电极薄膜批次AEdgeSealing）预清洗（去离子水）极Pre-Cleaning(DIWater)电背制程模块3电ProcessModule3制程模块2毛刷清洗封装膜铺叠导FoilPlacement明沉积¼TCO背电极薄膜Proce