电子专业术语

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1、GRRGaugeRepeatabilityReproducibilityM测的再现性与再生性FPIFirstPieceInspection首件检査Samplingwithoutreplacement不放回抽样SQA:Source(Supplier)QualityAudit供货商品质审核1.QC:qualitycontrol质量管理2.IQC:incomingqualitycontrol进料质量管理3.OQC:outputqualitycontrolil!货质量管理4.PQC:processqualitycontrol制程质量管理也称IPQC:inprocessqua

2、litycontrol.5.AQL:acceptablequalitylevel允收标准6.CQA:customerqualityassurance客八品质保证7.MA:majordefeat主要缺点&MI:minordefeat次要缺点9.CR:criticaldefeat关键缺点10.SMT:surfacemountingtechnology表而粘贴技术11.SMD:surfacemountingdevice表而粘贴程序SMC:surfacemountingcomponent表而粘贴纟11.件12.ECN:engineeringchangenotice工程变更通

3、知13.DCN:designchangenotice设计变更通知14.PCB:printedcircuitboard卬刷电路板15.PCBA:printedcircuitboardassembly装配卬刷电路板16.BOM:billofmaterial材料清单17.BIOS:basicallyinputandoutputsystem基本输入输出系统18.MIL-STD-105E:美国陆军标准，也称单次抽样计划.19.ISO:internationalstandardorganization国际标准化组织20.DRAM:内存条21.Polarity:电性22.Icic

4、les:锡尖23.Non-wetting:空焊24.Shortcircuit:短路25.Missingcomponent:缺件26.Wrongcomponent:错件27.Excesscomponent:多件28.Insufficientsolder:锡少29.Excessivesolder:锡多30.Solderresidue:锡渣31.Solderball:锡球32.Tombstone:墓碑33.Sideward：侧立34.Componentdamage:零件破损35.Goldfinger:金手指36.SOP:standardoperationprocess标准

5、操作流程37.SIP:standardinspectionprocess标准检验流程38.Thegoodandnotgoodsegregation:良品和不良品区分39.OBW:onboardwriter熠录BIOS40.Simplerandomsampling:简单随机抽样41.Histogram:直方图42.Standarddeviation:标准差43.C1P:Continuousimprovementprogram持续改善计划44.SPC:Statisticalprocesscontrol制程统制45.Sub-contractors:分包商46.SQE:Su

6、pplierqualityengineering47.Samplingsample:抽样计划48.Loader:治具49.QTS:Qualitytrackingsystem质量ill查系统50.Debug:调试51.Spareparts:备用品52.Inventoryreportfor:廉存表53.Manpower/TactestimationI'时预算54.Calibration:校验55.S/N:senalnumber序号56.Corrugatedpad:波纹热57.Takeouttray:内包装盒58.Outerbox:夕卜包装箱59.Vericode:检验码

7、60.Sumofsquare:平方和61.Range:全距62.Conductivebag:保护袋63.Preventivemaintenance:预防性维护64.Baseunit:基体65.Fixture:制具66.Probe:探针67.Hostprobe:主探针6&Goldencard:样本卡69.Diagnosticsprogram:诊断程序70.Frame:屏而71.Lint-freegloves:静电手套72.Wristwrap:静电手环73.Targetvalue:目标值74.Relateddepartment:相关部门75.liftedsolder