常用半导体词汇

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1、1目的为集成电路、分立器件标准化专门术语。2范围包括了集成电路、分立器件所使用的半导体专门术语。3内容标准化名称其它名称英文名称其它英文名称工序名称Process进料检验IncomingQCInspection(IQC)IQI磨片WaferGrindBackGrind贴片WaferMount甩干Spinning划片WaferSaw装片DieAttach(D/A)焊丝球焊，打金丝，打线，WireBond(W/B)焊线倒装芯片FlipChip(FC)热压焊ThermalCompressionBond(

2、TCB)烘烤烘箱BakingCuring全检三号目检3rdOpticalInspection(3rdOpt.)包封塑封MoldingEncapsulation冲塑冲胶Degate后固化PostMoldCure(PMC)切筋冲筋,切中筋DamcarCutTrim去飞边Deflash打印Marking激光打印Lasermarking油墨打印InkUVmarking电镀Plating锡铅电镀铅锡电镀TinLeadPlating无铅电镀纯锡电镀LeadFreePlatingPureTinPlating成型

3、Forming分离Singulation外观检产品出厂检OutGoingInspection(OGI)4thOpticalInspection测试Test分选编带Tape&Rail包装Packing出货Shipping组装FrontOFLine(FOL)芯片Die色点芯片InkDie引线框LeadFrame助焊剂Flux导电胶Epoxy蓝膜BlueTape/Mountingtape圆片Wafer金丝Goldwire推晶Dieshear弧高LoopHeight弧度WireLoop布线图Bonddia

4、gram布线错误WrongBonding焊丝拉力测克,拉丝WirePull推球金球剥离Ballshear细刀Capillary扭曲Bending翘曲Bow/Warpage硅屑SiliconDust沾污Contaminate压伤Dented变形Distort缺角ChipDie锡膏回流SolderReflow银厚度SilverThickness毛刺针刺Burr塌丝DepressWire超波膜UVTape火山口CraterRing断丝BrokenWire昂球LiftedBond飞球SkyBall金属剥落

5、LiftedMetal昂楔LiftedWedge高尔夫球GolfBall扁球FlatBall半球InsufficientBallSize不粘Non-Stick芯片裂缝CrackDie错方向WrongOrientation焊不牢IncompleteBond无焊NoBonding翘芯片LiftedDie误置芯片MisplacedDie芯片装斜TiltedDie芯面粘胶EpoxyOnDie导电胶不足InsufficientEpoxy多胶ExcessEpoxy导电胶气孔EpoxyVoid镀层气孔Solde

6、rVoid导电胶裂缝EpoxyCrack金属划伤SawIntoMetal擦痕Scratches墨溅InkSplash薄膜气泡TapeBubbles边沿芯片EdgeDie镜子芯片MirrorDie飞片FlyDie封装EndOfLine(EOL)排气Airvent托块Insert刀片Punch型腔Cavity料饼塑料,树脂,环氧MoldCompoundMoldpallet基岛Paddle(PAD)DAP共面性Coplanity点温计Digimite空封DummyMoldedStrip废胶跑料,废料Mo

7、ldFlash小脚GateRemain脚间距开档,总宽,跨度LeadTiptoTipTotalWidth,LeadDistance.包封偏差MoldingMismatch包封模具MoldChase冲切,成型模具Dieset清模MoldCleaning多肉PackageBump引线条MoldedStrip溢胶MoldBleed包反WrongOrientationMolding印偏OffsetMarking焊丝冲弯WireSweep错位MoldingMismatch偏心MoldingOffset气孔空

8、洞,气泡Void排气不畅AirVentClog偏脚OffsetPunch注浇口，进浇口InjectionGate1stGate上料框FrameLoader冲圆FanOut模温MoldTemperature表面粗糙RoughSurface未填充IncompleteMold料饼醒料CompoundAging顶针EjectorPin顶孔顶料孔EjectorPinhole定位块LocatorBlock粘模StickyMold烘箱Oven麻点镀层起毛SolderBlister锡桥搭锡Sold