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《SJT11200-1999环境试验第2部分试验方法试验Td表面组装元器件的可焊性》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、ICS19.040n21备案号:2585一1999SJ中华人民共和国电子行业标准SJ/T11200一1999idtIEC68一2一58:1989环境试验第2部分:试验方法试验Td:表面组装元器件的可焊性、金属化层耐熔蚀性和耐焊接热EnvironmentaltestingPart2:TestsTestTd:Solderability,resistancetodissolutionofmetallizationandtosolderingbeatofSurfaceMountingDevices1999-02-02发布1999-05-01实施中华人民共和国信息产业部发布目次前言IEC前言
2、1目的·····················,···············,,·······,,····················,,···············⋯⋯(1)2概述,···········‘···,甲······‘·4······,,···········甲··,··················4··⋯⋯(1)3定义····,。···············,·····················,··················,,·················,··‘····⋯⋯(1)4预处理,····‘·······1··,··,·
3、···】】·,··········,,·········。····,····,·,········,···⋯⋯(1)5试验设备与器材···································································,·····⋯⋯(2)5.1焊槽·············,·····,·····.......................................................····⋯⋯(2)5.2焊剂...................................................
4、.............................······⋯⋯(2)5.3焊料,,‘··················,·················,······································,·······⋯⋯(2)6程序················,·········。·,···········,·····················,···········,··············⋯⋯(2)6.1试验样品······,,····.........................................·
5、·······················⋯⋯(2)6.2夹持,·‘·············甲甲,··。。····、,,,甲,‘····,·········‘·。。·,,·,,,,······⋯⋯(2)6.3上焊剂··‘··,甲,·,·1··,··,·······,,···‘·······‘····。·····,·,···,······,·⋯⋯(2)6.4焊料中浸渍·····················································,·················,····⋯⋯(2)6.5评定···········‘·,·······
6、·‘···············································,·······,·····⋯⋯(3)7有关规范应作出的规定」···········........................................................(4)附录A(标准的附录)外观检查判据······,,··············,····················,·····‘····⋯⋯(6)附录B(提示的附录)试验导则···········,,······,,··········、············,·····,····
7、⋯⋯(8)前言本标准等同采用国际电工委员会IEC68-2-58(环境试验第2部分:试验方法试验Td:表面组装器件的可焊性、金属化层耐熔蚀性和耐焊接热》(1989年第1版)。本标准引用的其他国家标准有:GB2421一89电工电子产品基本环境试验规程总则(eqvIEC68一1:1982)GB/T2422-1995电工电子产品环境试验术语(eqvIEC68一5一2:1990)GB2423.28-82电工电子产品基本环境试验规程试验T:锡焊试验方法(eqvIEC68一2一20
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