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1、ConfidentialREPORTTitleofdocumentProjectnameProjectnumberAuthorReleaseDepartmentFilenameCreationdateExecutiveSummaryPage13of13Doc.No.:WI-00000VerNo.:01VerDate:00-MMM-2014InformationincludedinthisdocumentisthepropertyofIEES.A.Copy,useordisclosureo
2、fitscontents,eveninpart,isnotpermittedwithoutthepriorwrittenagreementofIEE.ThisdocumentisstrictlyIEEconfidential.ConfidentialREPORTTitleofdocumentTableofContents1Introduction31.1基本参数介绍32Activities42.1Theta-ja(θja)Junction-to-Ambient42.1.1测量方法42.1.2节温计算公式62
3、.2Theta-jc(θjc)Junction-to-Case62.2.1测量方法62.2.2节温计算公式62.2.3θjc与θja的关系72.3Theta-jb(θjb)Junction-to-Board72.3.1测量方法82.3.2节温计算公式82.3.3θjc与θja的关系82.4Ψ的含义92.4.1Ψjb92.4.2Ψjc92.5各种封装的散热效果92.5.1TIPowerPAD封装的使用注意事项103Results123.1关于θjaθjcΨJB,ΨJT使用问题124Discussion124.
4、1热仿真软件的使用125Conclusions125.1126Abbreviations,Definitiones,Glossary136.1137Version13Page13of13Doc.No.:WI-00000VerNo.:01VerDate:00-MMM-2014InformationincludedinthisdocumentisthepropertyofIEES.A.Copy,useordisclosureofitscontents,eveninpart,isnotpermittedwitho
5、utthepriorwrittenagreementofIEE.ThisdocumentisstrictlyIEEconfidential.ConfidentialREPORTTitleofdocumentContents1Introduction1.1基本参数介绍一般包括三个参数qja,θjc,θjb，三种参数所指的散热图示如下。Ta，Tb，Tc的测试点如下：Page13of13Doc.No.:WI-00000VerNo.:01VerDate:00-MMM-2014Informationincludedi
6、nthisdocumentisthepropertyofIEES.A.Copy,useordisclosureofitscontents,eveninpart,isnotpermittedwithoutthepriorwrittenagreementofIEE.ThisdocumentisstrictlyIEEconfidential.ConfidentialREPORTTitleofdocumentTc:芯片外壳的温度（其中Tt指芯片顶部，Tp指芯片底部。于Tc通用）Tb：芯片管脚接触于PCB处温度Ta:
7、芯片周围空气温度Tj:芯片内部PN节温度，此温度一般＜150℃，否则造成芯片烧毁。1Activities1.1Theta-ja(θja)Junction-to-AmbientPN节到空气的热阻。单位℃/W。1.1.1测量方法Page13of13Doc.No.:WI-00000VerNo.:01VerDate:00-MMM-2014InformationincludedinthisdocumentisthepropertyofIEES.A.Copy,useordisclosureofitscontents,e
8、veninpart,isnotpermittedwithoutthepriorwrittenagreementofIEE.ThisdocumentisstrictlyIEEconfidential.ConfidentialREPORTTitleofdocument器件说明书中的ΦJA是根据JESD51标准给出的，其标准环境是指将器件安装在较大的印刷电路板上，并置于1立方英尺的静止空气中。Θja与PCB叠层结构、芯
